CVケーブルの半導電層界面近傍での微視的な絶縁体微小高次構造と絶縁性能(最近の電力ケーブル技術<特集>)

• 資料種別: 記事
• タイトル: CVケーブルの半導電層界面近傍での微視的な絶縁体微小高次構造と絶縁性能
• 著者・編者: 石田 政義 他
• シリーズタイトル: 最近の電力ケーブル技術<特集>
• 著者標目: 石田 政義
• タイトル（掲載誌）: 電気学会論文誌. B, 電力・エネルギー部門誌 = IEEJ transactions on power and energy
• 巻号年月日等（掲載誌）: 112(10) 1992.10
• 掲載巻: 112
• 掲載号: 10
• 掲載ページ: p863～871
• 掲載年月日（W3CDTF）: 1992-10
• ISSN（掲載誌）: 0385-4213
• ISSN-L（掲載誌）: 0385-4213
• 出版事項（掲載誌）: 東京 : 電気学会
• 出版地（国名コード）: JP
• 本文の言語コード: jpn
• NDLC: ZN31
• 対象利用者: 一般
• 所蔵機関: 国立国会図書館
• 請求記号: Z16-794
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館雑誌記事索引; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 3795436; http://id.ndl.go.jp/bib/3795436
• 整理区分コード: 632

• 要約等: A new evaluation method of submicron morphological changes of the insulating polymer near the semiconducting interface in an XLPE power cable was proposed based on TEM observations. The method provides higher sensitivity on material degradation due to aging than the conventional methods. A long term aging test was carried out on an XLPE cable specimen with insulation thickness of 9mm. The specimen was aged under AC voltage stress of 63kV at 1kHz and heat-cycling thermal stress by the conductor current with real time of 13, 164h.<br>The experimental results show that the dielectric breakdown strengths did not decrease or rather slightly increased in spite of generation of bow-tie trees after the aging. Material analysis of the insulation was done and the result indicated that there were submicron morphological changes such as spherulite diameter and lamella thickness. It was suggested that these changes were brought by the thermal stress and might cause the slight increase of the breakdown strengths. Therefore it may be concluded that the new method is useful to detect fine material changes.
• DOI: 10.1541/ieejpes1990.112.10_863
• オンライン閲覧公開範囲: インターネット公開
• 連携機関・データベース: 科学技術振興機構 : J-STAGE; http://www.jstage.jst.go.jp

• 要約等: A new evaluation method of submicron morphological changes of the insulating polymer near the semiconducting interface in an XLPE power cable was proposed based on TEM observations. The method provides higher sensitivity on material degradation due to aging than the conventional methods. A long term aging test was carried out on an XLPE cable specimen with insulation thickness of 9mm. The specimen was aged under AC voltage stress of 63kV at 1kHz and heat-cycling thermal stress by the conductor current with real time of 13, 164h.<br>The experimental results show that the dielectric breakdown strengths did not decrease or rather slightly increased in spite of generation of bow-tie trees after the aging. Material analysis of the insulation was done and the result indicated that there were submicron morphological changes such as spherulite diameter and lamella thickness. It was suggested that these changes were brought by the thermal stress and might cause the slight increase of the breakdown strengths. Therefore it may be concluded that the new method is useful to detect fine material changes.
• DOI: 10.1541/ieejpes1990.112.10_863; https://doi.org/10.1541/ieejpes1990.112.10_863
• オンライン閲覧公開範囲: インターネット公開
• 関連情報（URI）: http://id.ndl.go.jp/bib/3795436; https://ndlsearch.ndl.go.jp/books/R000000004-I3795436; https://www.jstage.jst.go.jp/article/ieejpes1990/112/10/112_10_863/_pdf
• 参照: ポリプロピレン系新規絶縁材料の電力ケーブルへの適用(３); https://cir.nii.ac.jp/crid/1390282679570102656
• 連携機関・データベース: 国立情報学研究所 : CiNii Research; https://cir.nii.ac.jp/
• 提供元機関・データベース: Japan Link Center; https://japanlinkcenter.org/top; 雑誌記事索引データベース; https://ndlsearch.ndl.go.jp; Crossref; https://www.crossref.org; CiNii Articles
• 書誌ID（NDLBibID）: 3795436; http://id.ndl.go.jp/bib/3795436
• NII論文ID: 130006841237; 10012705946