Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.

• 資料種別: 図書
• ISBN: 9780791856888 (v. 1); 9780791856895 (v. 2); 9780791856901 (v. 3)
• タイトル: Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.
• 著者標目: creator. ： ASME International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (2015 : San Francisco, California, USA); contributor. ： International Conference on Nanochannels, Microchannels and Minichannels (13th : 2015 : San Francisco, California)
• 出版事項: New York, N.Y. : The American Society of Mechanical Engineers (出版)
• 出版年月日等: [2015]
• 出版年（W3CDTF）: 2015
• 数量: 3 volumes
• 形態の詳細: illustrations
• 大きさ: 28 cm
• 並列タイトル等: 2015 proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : IPACK2015
• 出版地（国名コード）: US
• 本文の言語コード: eng
• ジャンル・形式用語: Conference papers and proceedings.
• 表現種別: text
• 機器種別: unmediated
• キャリア種別: volume
• 件名標目: Electronic packaging--Congresses.; Electronic packaging.
• LCC: TK7870.15
• NDLC: M17
• 対象利用者: 一般
• 一般注記: Papers.; "This is the first time that the International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems (InterPACK) and the International Conference on Nanochannels, Microchannels and Minichannels (ICNMM) will jointly hold their conferences together."--Welcome message.; "It was renamed InterPACK in 1995, and has been occurring biannually since then."--Welcome message.
• 書誌注記: Includes bibliographical references and author indexes.
• 所蔵機関: 国立国会図書館
• 請求記号: M17-16-1112
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 027107714; http://id.ndl.go.jp/bib/027107714
• OCLC番号: 936497429; https://www.worldcat.org/oclc/936497429
• 目録規則: RDA
• 整理区分コード: 215

• 内容細目: v. 1. Thermal managementv. 2. Advanced electronics and photonics, packaging materials and processing ; Advanced electronics and photonics: packaging, ...