アルミニウム電解コンデンサのリード線溶接における接合界面のミクロ構造に及ぼすSnメッキの影響
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- Material Type
- 記事
- Author/Editor
- 久保内 達郎神谷 修
- Alternative Title
- Microstructure of bonding interface and influence of Sn plate in welding of lead for aluminum electrolytic condenser
- Periodical title
- 素材物性学雑誌 = Journal of the Society of Materials Engineering for Resources of Japan
- No. or year of volume/issue
- 23(1) (通号 37) 2010.4
- Volume
- 23
- Issue
- 1
- Sequential issue number
- 37