CVケーブルの半導電層界面近傍での微視的な絶縁体微小高次構造と絶縁性能(最近の電力ケーブル技術<特集>)

• Material Type: 記事
• Title: CVケーブルの半導電層界面近傍での微視的な絶縁体微小高次構造と絶縁性能
• Author/Editor: 石田 政義 他
• Series Title: 最近の電力ケーブル技術<特集>
• Author Heading: 石田 政義
• Periodical title: 電気学会論文誌. B, 電力・エネルギー部門誌 = IEEJ transactions on power and energy
• No. or year of volume/issue: 112(10) 1992.10
• Volume: 112
• Issue: 10
• Pages: p863～871
• Publication date of volume/issue (W3CDTF): 1992-10
• ISSN (Periodical Title): 0385-4213
• ISSN-L (Periodical Title): 0385-4213
• Publication (Periodical Title): 東京 : 電気学会
• Place of Publication (Country Code): JP
• Text Language Code: jpn
• NDLC: ZN31
• Target Audience: 一般
• Holding library: 国立国会図書館
• Call No.: Z16-794
• Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引; https://ndlsearch.ndl.go.jp
• Bibliographic ID (NDL): 3795436; http://id.ndl.go.jp/bib/3795436
• Bibliographic Record Category (NDL): 632

• Summary, etc.: A new evaluation method of submicron morphological changes of the insulating polymer near the semiconducting interface in an XLPE power cable was proposed based on TEM observations. The method provides higher sensitivity on material degradation due to aging than the conventional methods. A long term aging test was carried out on an XLPE cable specimen with insulation thickness of 9mm. The specimen was aged under AC voltage stress of 63kV at 1kHz and heat-cycling thermal stress by the conductor current with real time of 13, 164h.<br>The experimental results show that the dielectric breakdown strengths did not decrease or rather slightly increased in spite of generation of bow-tie trees after the aging. Material analysis of the insulation was done and the result indicated that there were submicron morphological changes such as spherulite diameter and lamella thickness. It was suggested that these changes were brought by the thermal stress and might cause the slight increase of the breakdown strengths. Therefore it may be concluded that the new method is useful to detect fine material changes.
• DOI: 10.1541/ieejpes1990.112.10_863
• Access Restrictions: インターネット公開
• Data Provider (Database): 科学技術振興機構 : J-STAGE; http://www.jstage.jst.go.jp

• Summary, etc.: A new evaluation method of submicron morphological changes of the insulating polymer near the semiconducting interface in an XLPE power cable was proposed based on TEM observations. The method provides higher sensitivity on material degradation due to aging than the conventional methods. A long term aging test was carried out on an XLPE cable specimen with insulation thickness of 9mm. The specimen was aged under AC voltage stress of 63kV at 1kHz and heat-cycling thermal stress by the conductor current with real time of 13, 164h.<br>The experimental results show that the dielectric breakdown strengths did not decrease or rather slightly increased in spite of generation of bow-tie trees after the aging. Material analysis of the insulation was done and the result indicated that there were submicron morphological changes such as spherulite diameter and lamella thickness. It was suggested that these changes were brought by the thermal stress and might cause the slight increase of the breakdown strengths. Therefore it may be concluded that the new method is useful to detect fine material changes.
• DOI: 10.1541/ieejpes1990.112.10_863; https://doi.org/10.1541/ieejpes1990.112.10_863
• Access Restrictions: インターネット公開
• Related Material (URI): http://id.ndl.go.jp/bib/3795436; https://ndlsearch.ndl.go.jp/books/R000000004-I3795436; https://www.jstage.jst.go.jp/article/ieejpes1990/112/10/112_10_863/_pdf
• Is Referenced By: ポリプロピレン系新規絶縁材料の電力ケーブルへの適用(３); https://cir.nii.ac.jp/crid/1390282679570102656
• Data Provider (Database): 国立情報学研究所 : CiNii Research; https://cir.nii.ac.jp/
• Original Data Provider (Database): Japan Link Center; https://japanlinkcenter.org/top; 雑誌記事索引データベース; https://ndlsearch.ndl.go.jp; Crossref; https://www.crossref.org; CiNii Articles
• Bibliographic ID (NDL): 3795436; http://id.ndl.go.jp/bib/3795436
• NAID: 130006841237; 10012705946