Copper electroplating process for sub-half-micron ULSI structures UCRL-JC-119725 DE95 014674 CONF-95062061

Copper electroplating process for sub-half-micron ULSI structures

UCRL-JC-119725 DE95 014674 CONF-95062061

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Material Type: 規格・テクニカルリポート類
Title: Copper electroplating process for sub-half-micron ULSI structures
Author/Editor: Contolini, R. J
Tarte, L
Graff, R. T
Evans, L. B
Cox, J. N
Publication Date: 1995
Publication Date (W3CDTF): 1995
Extent: 9 p. (1 microfiche)
Note (Material Type): [microform]
Report No.: テクニカルリポート番号 : UCRL-JC-119725
テクニカルリポート番号 : DE95 014674
テクニカルリポート番号 : CONF-95062061
Holding library: 国立国会図書館
Call No.: LS-DE95/014674
Data Provider (Database): 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 000005536342
http://id.ndl.go.jp/bib/000005536342
Bibliographic Record Category (NDL): 291