Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition

Journal name: ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1

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Summary, etc.：: <jats:p>Mechanical evaluation method of adhesive strength for bonding IC chips in chip-stacked packages is investigated. These film adhesives are requ...

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Material Type: 記事
Title: Evaluation of the Reliability of Film Adhesives Under Hygrothermal Condition
Author Heading: Kikuo Kishimoto
Naoya Saiki
Hideo Senoo
Kazuaki Inaba
Publication Date: 2011-01-01
Publication Date (W3CDTF): 2011-01-01
Periodical title: ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1
Pages: 473-478
Publication date of volume/issue (W3CDTF): 2011-01-01
Publication (Periodical Title): ASMEDC
Target Audience: 一般
DOI: 10.1115/ipack2011-52096
Data Provider (Database): 国立情報学研究所 : CiNii Research
https://cir.nii.ac.jp/
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