J-integral evaluation for an interface crack under thermal load using digital image correlation

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J-integral evaluation for an interface crack under thermal load using digital image correlation

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Summary, etc.：: In this study, a method for evaluating a fracture parameter, J-integral, for an interface crack from the displacement fields under thermal deformatio...

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Material Type: 記事
Title: J-integral evaluation for an interface crack under thermal load using digital image correlation
Author Heading: Yasuaki Watanabe
Tatsuhiko Asai
Hiroto Yamane
Kunio Shiokawa
Satoru Yoneyama
Shuichi Arikawa
Publication Date: 2015-03-04
Publication Date (W3CDTF): 2015-03-04
Periodical title: SPIE Proceedings
No. or year of volume/issue: 9302
Volume: 9302
Pages: 93022G-
Publication date of volume/issue (W3CDTF): 2015-03-04
ISSN (Periodical Title): 0277786X
Publication (Periodical Title): SPIE
Target Audience: 一般
DOI: 10.1117/12.2076716
https://doi.org/10.1117/12.2076716
Data Provider (Database): 国立情報学研究所 : CiNii Research
https://cir.nii.ac.jp/
Original Data Provider (Database)