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IC chip stress during plastic package molding SAND980383C DE98 002897 CONF980550

IC chip stress during plastic package molding SAND980383C DE98 002897 CONF980550
Microform規格・テクニカルリポート類
Palmer, D. W, Benson, D. A, Peterson, D. W, Sweet, J. N1998<LS-DE98/002897>
National Diet Library

Validating theoretical calculations of thermomechanical stress and deformation using the ATC4.1 flip-chip test vehicle SAND-97-1969C DE97 008360 CONF-9709772

Validating theoretical calculations of thermomechanical stress and deformation using the ATC4.1 flip-chip test vehicle SAND-97-1969C DE97 008360 CONF-9709772
Microform規格・テクニカルリポート類
Peterson, D. W, Sweet, J. N, Burchett, S. N1997<LS-DE97/008360>
National Diet Library

High reliability plastic packaging for microelectronics SAND-97-1721 DE97 008786

High reliability plastic packaging for microelectronics SAND-97-1721 DE97 008786
Microform規格・テクニカルリポート類
Sweet, J. N, Peterson, D. W, Hsia, A. H, Tuck, M1997<LS-DE97/008786>
National Diet Library

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method SAND-96-2616C DE97 003842 CONF-9705692

Stresses from flip-chip assembly and underfill; measurements with the ATC4.1 assembly test chip and analysis by finite element method SAND-96-2616C DE97 003842 CONF-9705692
Microform規格・テクニカルリポート類
Peterson, D. W, Sweet, J. N, Burchett, S. N, Hsia, A1996<LS-DE97/003842>
National Diet Library

Development of solid state moisture sensors for semiconductor fabrication applications SAND-94-1533C DE94 015771 CONF-94101611

Development of solid state moisture sensors for semiconductor fabrication applications SAND-94-1533C DE94 015771 CONF-94101611
Microform規格・テクニカルリポート類
Pfeifer, K. B, Kelly, M. J, Guilinger, T. R, Peterson, D. W, Sweet, J. N1994<LS-DE94/015771>
National Diet Library

EVALUATING PLASTIC ASSEMBLY PROCESSES FOR HIGH RELIABILITY APPLICATIONS USING HAST AND ASSEMBLY TEST CHIPS (SAND ; SAND-94-0912C)

EVALUATING PLASTIC ASSEMBLY PROCESSES FOR HIGH RELIABILITY APPLICATIONS USING HAST AND ASSEMBLY TEST CHIPS (SAND ; SAND-94-0912C)
Paper図書
EMERSON, J.A.// SWEET, J.N.// PETERSON, D.W. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingEMERSON, J.A. SWEET, J.N. PETERSON, D.W.

HIGH ACCURACY DIE MECHANICAL STRESS MEASUREMENT WITH THE ATC04 ASSEMBLY TEST CHIP (SAND ; SAND-93-1837C)

HIGH ACCURACY DIE MECHANICAL STRESS MEASUREMENT WITH THE ATC04 ASSEMBLY TEST CHIP (SAND ; SAND-93-1837C)
Paper図書
SWEET, J.N.// PETERSON, D.W. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1993.
Other Libraries in Japan
  • Author HeadingSWEET, J.N. PETERSON, D.W.

USE OF SPECIAL PURPOSE ASSEMBLY TEST CHIPS FOR EVALUATING RELIABILITY IN PACKAGED DEVICES (SAND ; SAND-92-1797C)

USE OF SPECIAL PURPOSE ASSEMBLY TEST CHIPS FOR EVALUATING RELIABILITY IN PACKAGED DEVICES (SAND ; SAND-92-1797C)
Paper図書
SWEET, J.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1992.
Other Libraries in Japan
  • Author HeadingSWEET, J.N.

DEVELOPMENT OF SOLID STATE MOISTURE SENSORS FOR SEMICONDUCTOR FABRICATION APPLICATIONS (SAND ; SAND-94-1533C)

DEVELOPMENT OF SOLID STATE MOISTURE SENSORS FOR SEMICONDUCTOR FABRICATION APPLICATIONS (SAND ; SAND-94-1533C)
Paper図書
PFEIFER, K.B.// KELLY, M.J.// GUILINGER, T.R.// PETERSON, D.W.// SWEET, J.N.// TUCK, M.R. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1994.
Other Libraries in Japan
  • Author HeadingPFEIFER, K.B. KELLY, M.J. GUILINGER, T.R. PETERSON, D.W. SWEET, J.N. TUCK, M.R.

HAST EVALUATION OF ORGANIC LIQUID IC ENCAPSULANTS USING SANDIA'S ASSEMBLY TEST CHIPS (SAND ; SAND-91-2578C)

HAST EVALUATION OF ORGANIC LIQUID IC ENCAPSULANTS USING SANDIA'S ASSEMBLY TEST CHIPS (SAND ; SAND-91-2578C)
Paper図書
EMERSON, J.A.// PETERSON, D.W.// SWEET, J.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingEMERSON, J.A. PETERSON, D.W. SWEET, J.N.

MULTICHIP MODULE ENABLERS FOR HIGH RELIABILITY APPLICATIONS (SAND ; SAND-91-2738C)

MULTICHIP MODULE ENABLERS FOR HIGH RELIABILITY APPLICATIONS (SAND ; SAND-91-2738C)
Paper図書
CHU, D.// REBER, C.A.// DRAPER, B.L.// SWEET, J.N.// PALMER, D.W. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingCHU, D. REBER, C.A. DRAPER, B.L. SWEET, J.N. PALMER, D.W.

ANALYSIS AND MEASUREMENT OF THERMAL RESISTANCE IN A 3-DIMENSIONAL SILICON MULTICHIP MODULE POPULATED WITH ASSEMBY TEST CHIPS (SAND ; SAND-92-1906C)

ANALYSIS AND MEASUREMENT OF THERMAL RESISTANCE IN A 3-DIMENSIONAL SILICON MULTICHIP MODULE POPULATED WITH ASSEMBY TEST CHIPS (SAND ; SAND-92-1906C)
Paper図書
SWEET, J.N.// PETERSON, D.W.// CHU, D.// BAINBRIDGE, B.L.// GASSMAN, R.A.// REBER, C.A. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1992.
Other Libraries in Japan
  • Author HeadingSWEET, J.N. PETERSON, D.W. CHU, D. BAINBR...

OXIDIZED POROUS SILICON MOISTURE SENSORS FOR EVALUATION OF MICROELECTRONIC PACKAGING (SAND ; SAND-90-3085C)

OXIDIZED POROUS SILICON MOISTURE SENSORS FOR EVALUATION OF MICROELECTRONIC PACKAGING (SAND ; SAND-90-3085C)
Paper図書
KELLY, M.J.// GUILINGER, T.R.// PETERSON, D.W.// TUCK, M.R.// SWEET, J.N. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (USA))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingKELLY, M.J. GUILINGER, T.R. PETERSON, D.W. TUCK, M.R. SWEET, J.N.

SHORT AND LONG LOOP MANUFACTURING FEEDBACK USING A MULTI-SENSOR ASSEMBLY TEST CHIP (SAND ; SAND-90-2033C)

SHORT AND LONG LOOP MANUFACTURING FEEDBACK USING A MULTI-SENSOR ASSEMBLY TEST CHIP (SAND ; SAND-90-2033C)
Paper図書
SWEET, J.N.// TUCK, M.R.// PETERSON, D.W.// PALMER, D.W. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (USA))Sandia National Laboratories(Sandia National Laboratories)1990.
Other Libraries in Japan
  • Author HeadingSWEET, J.N. TUCK, M.R. PETERSON, D.W. PAL...

EVALUATION OF CHIP PASSIVATION AND COATINGS USING SPECIAL PURPOSE ASSEMBLY TEST CHIPS AND POROUS SILICON MOISTURE DETECTORS (SAND ; SAND-91-0846C)

EVALUATION OF CHIP PASSIVATION AND COATINGS USING SPECIAL PURPOSE ASSEMBLY TEST CHIPS AND POROUS SILICON MOISTURE DETECTORS (SAND ; SAND-91-0846C)
Paper図書
SWEET, J.N.// PETERSON, D.W.// TUCK, M.R.// KELLY, M.J.// GUILLINGER, T.R. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (USA))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingSWEET, J.N. PETERSON, D.W. TUCK, M.R. KEL...

VAPOR SENSORS FORMED BY CHEMICAL MODIFICATION OF POROUS SILICON (SAND ; SAND-91-0911C)

VAPOR SENSORS FORMED BY CHEMICAL MODIFICATION OF POROUS SILICON (SAND ; SAND-91-0911C)
Paper図書
KELLY, M.J.// GUILINGER, T.R.// GRANSTAFF, V.E.// PETERSON, D.W.// SWEET, J.N.// TUCK, M.R. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (UNITED STATES))Sandia National Laboratories(Sandia National Laboratories)1991.
Other Libraries in Japan
  • Author HeadingKELLY, M.J. GUILINGER, T.R. GRANSTAFF, V.E. PETERSON, D.W. SWEET, J.N. TUCK, M.R.

ASSEMBLY TEST CHIP VERSION 01 DESCRIPTION AND USERS MANUAL (SAND ; SAND-90-0755)

ASSEMBLY TEST CHIP VERSION 01 DESCRIPTION AND USERS MANUAL (SAND ; SAND-90-0755)
Paper図書
SWEET, J.N.// PETERSON, D.W.// TUCK, M.R.// RENNINGER, D.J. (SANDIA NATIONAL LABS., ALBUQUERQUE, NM (USA))Sandia National Laboratories(Sandia National Laboratories)1990.
Other Libraries in Japan
  • Author HeadingSWEET, J.N. PETERSON, D.W. TUCK, M.R. REN...

Effect of experimental variables on flash thermal diffusivity data analysis (SAND ; SAND-87-1392C; CONF-8710249-1; DE88003631)

Effect of experimental variables on flash thermal diffusivity data analysis (SAND ; SAND-87-1392C; CONF-8710249-1; DE88003631)
Paper図書
Sweet, J.N.Sandia National Labs.1987.10.
Other Libraries in Japan
  • Author HeadingSweet, J.N.

Comparative thermal conductivity measurements at Sandia National Laboratories (Sandia report ; SAND-86-0840; DE86012926)

Comparative thermal conductivity measurements at Sandia National Laboratories (Sandia report ; SAND-86-0840; DE86012926)
Paper図書
Sweet, J.N., Roth, E.P., Moss, M. [et al.]Sandia National Labs.1986.06.
Other Libraries in Japan
  • Author HeadingSweet, J.N. Roth, E.P. Moss, M. Haseman, ...

USE OF NUMERICAL HEAT-TRANSFER TECHNIQUES TO ANALYZE THERMAL-COMPARATOR CONDUCTIVITY MEASUREMENTS. (SAND ; SAND-83-2109C)

USE OF NUMERICAL HEAT-TRANSFER TECHNIQUES TO ANALYZE THERMAL-COMPARATOR CONDUCTIVITY MEASUREMENTS. (SAND ; SAND-83-2109C)
Paper図書
SWEET, J.N.(et al.)Sandia National Laboratories(Sandia National Laboratories)1983.
Other Libraries in Japan
  • Author HeadingSWEET, J.N.
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