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Proceedings of ASME 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2021) : October 26-28, 2021 : virtual, online : InterPACK : artificial intelligence workshop : Oct 2021, ------.

Proceedings of ASME 2021 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : (InterPACK2021) : October 26-28, 2021 : virtual, online : InterPACK : artificial intelligence workshop : Oct 2021, ------.
紙図書
The American Society of Mechanical Engineers (ASME)[2021]<M17-22-575>
国立国会図書館
  • LCCTK7870.15

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.
紙図書
The American Society of Mechanical Engineers[2020]<M17-20-1371>
国立国会図書館
  • LCCTK7870.15

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications
紙図書
editor-in-chief, Avram Bar-Cohen.World Scientific Publishing Co. Pte. Ltd.[2019]<ND351-B96>
国立国会図書館
  • LCCTK7870.15

Electronic enclosures, housings and packages (Woodhead Publishing series in electronic and optical materials)

Electronic enclosures, housings and packages (Woodhead Publishing series in electronic and optical materials)
紙図書
Dr Frank Süli.Woodhead Publishing[2019]<ND351-B94>
国立国会図書館
  • LCCTK7870.15

2016 IEEE 25th conference on electrical performance of electronic packaging and systems (EPEPS 2016) : San Diego, California, USA : 23-26 October 2016 : EPEPS-2016 : EPEPS meetings : Oct 2016, San Diego, CA.

2016 IEEE 25th conference on electrical performance of electronic packaging and systems (EPEPS 2016) : San Diego, California, USA : 23-26 October 2016 : EPEPS-2016 : EPEPS meetings : Oct 2016, San Diego, CA.
紙図書
IEEE[2016]<M17-18-1866>
国立国会図書館
  • LCCTK7870.15

2016 17th international conference on electronic packaging technology : (ICEPT 2016) : Wuhan, China : 16-19 August 2016 : Aug 2016, Wuhan, China.

2016 17th international conference on electronic packaging technology : (ICEPT 2016) : Wuhan, China : 16-19 August 2016 : Aug 2016, Wuhan, China.
紙図書
IEEE[2016]<M17-18-429>
国立国会図書館
  • LCCTK7870.15

2016 11th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2016) : Taipei, Taiwan : 26-28 October 2016 : IMPACT--IAAC 2016 : IMPACT-IAAC 2016 joint conference : IMPACT2016 : Oct 2016, Taipei, Taiwan.

2016 11th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2016) : Taipei, Taiwan : 26-28 October 2016 : IMPACT--IAAC 2016 : IMPACT-IAAC 2016 joint conference : IMPACT2016 : Oct 2016, Taipei, Taiwan.
紙図書
IEEE[2016]<M17-18-960>
国立国会図書館
  • LCCTK7870.15

2016 IEEE 22nd international symposium for design and technology in electronic packaging (SIITME 2016) : Oradea, Romania : 20-23 October 2016 : SIITME 2016 conference : SIITME2016 : Oct 2016, Oradea, Romania.

2016 IEEE 22nd international symposium for design and technology in electronic packaging (SIITME 2016) : Oradea, Romania : 20-23 October 2016 : SIITME 2016 conference : SIITME2016 : Oct 2016, Oradea, Romania.
紙図書
IEEE[2016]<M17-18-363>
国立国会図書館
  • LCCTK7870.15

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2017-- : presented at ASME 2017 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 29-September 1, 2017 : San Francisco, California, USA : InterPACK : InterPACK2017 : Aug 2017, San Francisco, CA.
紙図書
The American Society of Mechanical Engineers[2017]<M17-19-909>
国立国会図書館
  • LCCTK7870.15

Encyclopedia of thermal packaging : a guide to cooling of electronic equipment. Set 2 Thermal packaging tools

Encyclopedia of thermal packaging : a guide to cooling of electronic equipment. Set 2 Thermal packaging tools
紙図書
editor-in-chief, Avram Bar-Cohen.World Scientific[2015]<ND351-B64>
国立国会図書館
  • LCCTK7870.15

2015 10th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2015) : Taipei, Taiwan : 21-23 October 2015 : Oct 2015, Taipei, Taiwan.

2015 10th international microsystems, packaging, assembly and circuits technology conference : (IMPACT 2015) : Taipei, Taiwan : 21-23 October 2015 : Oct 2015, Taipei, Taiwan.
紙図書
IEEE[2015]<M17-17-1375>
国立国会図書館
  • LCCTK7870.15

2016 IEEE 18th electronics packaging technology conference (EPTC 2016) : Singapore : 30 November-3 December 2016 : Nov 2016, Singapore.

2016 IEEE 18th electronics packaging technology conference (EPTC 2016) : Singapore : 30 November-3 December 2016 : Nov 2016, Singapore.
紙図書
IEEE[2016]<M17-19-118>
国立国会図書館
  • LCCTK7870.15

2015 IEEE 17th electronics packaging and technology conference (EPTC 2015) : Singapore : 2-4 December 2015 : Dec 2015, Singapore.

2015 IEEE 17th electronics packaging and technology conference (EPTC 2015) : Singapore : 2-4 December 2015 : Dec 2015, Singapore.
紙図書
IEEE[2015]<M17-17-760>
国立国会図書館
  • LCCTK7870.15

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2015-- : presented at ASME 2015 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : July 6-9, 2015 : San Francisco, California, USA : InterPACK : InterPACK/ICNMM : InterPACK2015 : Jul 2015, San Francisco, CA.
紙図書
The American Society of Mechanical Engineers[2015]<M17-16-1112>
国立国会図書館
  • LCCTK7870.15

2015 international conference on electronics packaging and iMAPS all Asia conference : (ICEP-IACC 2015) : Kyoto, Japan : 14-17 April 2015 : ICEP-IAAC2015 : joint conference of ICEP (the international conference on electronics packaging) and IAAC (IMAPS all Asia conference) : 4th IAAC : Apr 2015, Kyoto, Japan.

2015 international conference on electronics packaging and iMAPS all Asia conference : (ICEP-IACC 2015) : Kyoto, Japan : 14-17 April 2015 : ICEP-IAAC2015 : joint conference of ICEP (the international conference on electronics packaging) and IAAC (IMAPS all Asia conference) : 4th IAAC : Apr 2015, Kyoto, Japan.
紙図書
IEEE[2015]<M17-17-762>
国立国会図書館
  • LCCTK7870.15

2015 16th international conference on electronic packaging technology : (ICEPT 2015) : Changsha, China : 11-14 August 2015 : Aug 2015, Changsha, China.

2015 16th international conference on electronic packaging technology : (ICEPT 2015) : Changsha, China : 11-14 August 2015 : Aug 2015, Changsha, China.
紙図書
IEEE[2015]<M17-17-755>
国立国会図書館
  • LCCTK7870.15

2015 IEEE CPMT symposium Japan (ICSJ 2015) : Kyoto, Japan : 9-11 November 2015 : leading international components, packaging, and manufacturing technology symposium : ICSJ2015 : Nov 2015, Kyoto, Japan.

2015 IEEE CPMT symposium Japan (ICSJ 2015) : Kyoto, Japan : 9-11 November 2015 : leading international components, packaging, and manufacturing technology symposium : ICSJ2015 : Nov 2015, Kyoto, Japan.
紙図書
IEEE[2015]<M17-17-617>
国立国会図書館
  • LCCTK7870.15

2015 IEEE 24th electrical performance of electronic packaging and systems : (EPEPS 2015) : San Jose, California, USA : 25-28 October 2015 : 2015 IEEE 24th conference on electrical performance of electronic packaging and systems : EPEPS-2015 : Oct 2015, San Jose, CA.

2015 IEEE 24th electrical performance of electronic packaging and systems : (EPEPS 2015) : San Jose, California, USA : 25-28 October 2015 : 2015 IEEE 24th conference on electrical performance of electronic packaging and systems : EPEPS-2015 : Oct 2015, San Jose, CA.
紙図書
IEEE[2015]<M17-17-734>
国立国会図書館
  • LCCTK7870.15

2014 electronic system-integration technology conference : (ESTC 2014) : Helsinki, Finland : 16-18 September 2014 : 5th electronics system-integration technology conference and exhibition : Sep 2014, Helsinki, Finland.

2014 electronic system-integration technology conference : (ESTC 2014) : Helsinki, Finland : 16-18 September 2014 : 5th electronics system-integration technology conference and exhibition : Sep 2014, Helsinki, Finland.
紙図書
IEEE[2014]<M17-15-1461>
国立国会図書館
  • LCCTK7870.15

2014 IEEE 20th international symposium for design and technology in electronic packaging : (SIITME 2014) : Bucharest, Romania : 23-26 October 2014 : SIITME 2014 conference : SIITME2014 : Oct 2014, Bucharest, Romania. CFP1407I-ART

2014 IEEE 20th international symposium for design and technology in electronic packaging : (SIITME 2014) : Bucharest, Romania : 23-26 October 2014 : SIITME 2014 conference : SIITME2014 : Oct 2014, Bucharest, Romania. CFP1407I-ART
紙図書
IEEE[2014]<M17-16-1285>
国立国会図書館
  • LCCTK7870.15