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検索結果 9 件

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems -- 2005 : (...) : presented at 2005 ASME international mechanical engineering congress and exposition : November 5-11, 2005 : Orlando, Florida USA. : Nov 2005, Orlando, FL. (EPP ; 5)

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems -- 2005 : (...) : presented at 2005 ASME international mechanical engineering congress and exposition : November 5-11, 2005 : Orlando, Florida USA. : Nov 2005, Orlando, FL. (EPP ; 5)
紙図書
ASMEc2005.<M17-06-1093>
国立国会図書館
  • 件名...-- Congresses. Integrated circuits -- Wafer-scale integration -- Congresses.

Electronic and photonics packaging, electrical systems design and photonics, and nanotechnology : Allan Kraus symposium on heat transfer : (...) : presented at 2004 ASME international mechanical engineering congress and exposition : November 13-19, 2004 : Anaheim, California USA. : Nov 2004, Anaheim, CA. (EPP ; 4)

Electronic and photonics packaging, electrical systems design and photonics, and nanotechnology : Allan Kraus symposium on heat transfer : (...) : presented at 2004 ASME international mechanical engineering congress and exposition : November 13-19, 2004 : Anaheim, California USA. : Nov 2004, Anaheim, CA. (EPP ; 4)
紙図書
ASMEc2004.<M17-05-694>
国立国会図書館
  • 件名...-- Congresses. Integrated circuits -- Wafer-scale integration -- Congresses.

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2003 : presented at the 2003 ASME international mechanical engineering congress : November 15-21, 2003 : Washington, D.C. : Nov 2003, Washington, DC. (EPP ; 3)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2003 : presented at the 2003 ASME international mechanical engineering congress : November 15-21, 2003 : Washington, D.C. : Nov 2003, Washington, DC. (EPP ; 3)
紙図書
American Society of Mechanical Engineersc2003.<M17-04-2205>
国立国会図書館
  • 件名...-- Congresses. Integrated circuits -- Wafer-scale integration -- Congresses.

Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A. : symposium E, "materials and technolgies for 3-D integration" : 2008 MRS fall meeting : Dec 2008, Boston, MA. (Materials Research Society Symposia Proceedings ; 1112)

Materials and technologies for 3-D integration : symposium held December 1-3, 2008, Boston, Massachusetts, U.S.A. : symposium E, "materials and technolgies for 3-D integration" : 2008 MRS fall meeting : Dec 2008, Boston, MA. (Materials Research Society Symposia Proceedings ; 1112)
紙図書
Materials Research Societyc2009.<M17-10-333>
国立国会図書館
  • 件名...-- Congresses. Integrated circuits -- Wafer-scale integration -- Congresses. Integrated circuits -- Mater...

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2002 : presented at the 2002 ASME international mechanical engineering congress and exposition : November 17-22, 2002, New Orleans, Louisiana. : EPP : Nov 2002, New Orleans, LA. (EPP ; 2)

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology -- 2002 : presented at the 2002 ASME international mechanical engineering congress and exposition : November 17-22, 2002, New Orleans, Louisiana. : EPP : Nov 2002, New Orleans, LA. (EPP ; 2)
紙図書
American Society of Mechanical Engineersc2002.<M17-03-1043>
国立国会図書館
  • 件名...-- Congresses. Integrated circuits -- Wafer-scale integration -- Congresses.

Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA

Electronic and photonics packaging : multi-scale electrical and mechanical systems : presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois USA
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASMEAmerican Society of Mechanical Engineersc2007
全国の図書館
  • 件名... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses
  • 件名（識別子）... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA

Electronic and photonic packaging, integration and packaging of micro/nano/electronic systems - 2005 : presented at the 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orland, Florida USA
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASMEAmerican Society of Mechanical Engineersc2005
全国の図書館
  • 件名... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses
  • 件名（識別子）... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses

Electronic and photonic packaging, electrical systems design and photonics, and nanotechnology : presented at the 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California USA

Electronic and photonic packaging, electrical systems design and photonics, and nanotechnology : presented at the 2004 ASME International Mechanical Engineering Congress and Exposition : November 13-19, 2004, Anaheim, California USA
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASMEAmerican Society of Mechanical Engineersc2004
全国の図書館
  • 件名... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses
  • 件名（識別子）... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.

Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C.
紙図書
sponsored by the Electronic and Photonic Packaging Division, ASME ; organized by Ricky Lee ... [et al.]American Society of Mechanical Engineersc2003
全国の図書館
  • 件名... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses
  • 件名（識別子）... -- Congresses Integrated circuits -- Wafer-scale integration -- Congresses

検索結果は以上です。

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