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Modified atmosphere packaging of foods : principles and applications (IFT Press series)

Modified atmosphere packaging of foods : principles and applications (IFT Press series)
紙図書
Dong Sun LeeJohn Wiley & Sons, Inc.2021<PC111-D10>
国立国会図書館全国の図書館
  • 件名Food--Packaging Modified atmosphere packaging Modified atmosphere packaging.

Bio-based packaging : material, environmental and economic aspects (Wiley series in renewable resources)

Bio-based packaging : material, environmental and economic aspects (Wiley series in renewable resources)
紙図書
edited by S.M. Sapuan, R.A. IlyasJohn Wiley & Sons, Inc.2021<NB141-D2>
国立国会図書館全国の図書館

Functionality of cyclodextrins in encapsulation for food applications

Functionality of cyclodextrins in encapsulation for food applications
紙図書
Thao M. Ho, Hidefumi Yoshii, Keiji Terao, Bhesh R. Bhandari, editorsSpringer[2021]<PA531-D5>
国立国会図書館
  • 件名Cyclodextrins Food--Packaging Cyclodextrins. Food--Packaging.

Packaging materials and processing for food, pharmaceuticals and cosmetics (Sciences, agronomy and food science) (Statistics, Geostatistics)

Packaging materials and processing for food, pharmaceuticals and cosmetics (Sciences, agronomy and food science) (Statistics, Geostatistics)
紙図書
coordinated by Frédéric Debeaufort, Kata Galić, Mia Kurek, Nasreddine Benbettaieb, Mario ŠčetarISTE2021<PC111-D11>
国立国会図書館

Nanotechnology in edible food packaging : food preservation practices for a sustainable future (Materials horizons : from nature to nanomaterials)

Nanotechnology in edible food packaging : food preservation practices for a sustainable future (Materials horizons : from nature to nanomaterials)
紙図書
Vimal Katiyar, Tabli GhoshSpringer[2021]<PC111-D12>
国立国会図書館全国の図書館
  • 件名Food--Packaging Nanotechnology Food--Packaging. Nanotechnology.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2019-- : presented at ASME 2019 international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : October 7-9, 2019 : Anaheim, California, USA : InterPACK : robotics, self-driving cars and artificial intelligence workshop : InterPACK2019 : Oct 2019, Anaheim, CA.
紙図書
The American Society of Mechanical Engineers[2020]<M17-20-1371>
国立国会図書館
  • 件名Electronic packaging--Congresses. Electronic packaging.

Food packaging materials : current protocols (Methods and protocols in food science) (Springer Protocols)

Food packaging materials : current protocols (Methods and protocols in food science) (Springer Protocols)
紙図書
edited by Caio OtoniHumana Press[2024]<PC111-D19>
国立国会図書館
  • 要約等...dures for food packaging. Chapters are divided into thr...

Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology

Encyclopedia of packaging materials, processes, and mechanics. Set 1 Interconnect and wafer bonding technology
紙図書
editor-in-chief Avram Bar-Cohen, Jeffrey C Suhling and Andrew A.O. Tay.World Scientific Publishing Co. Pte. Ltd.[2020]<NB141-D1>
国立国会図書館
  • 件名Packaging.

Biopolymer-based food packaging : innovations and technology applications

Biopolymer-based food packaging : innovations and technology applications
紙図書
edited by Santosh Kumar, Avik Mukherjee, Joydeep DuttaJohn Wiley & Sons, Inc.[2022]<PC111-D15>
国立国会図書館全国の図書館

Sustainable packaging (Environmental footprints and eco-design of products and processes)

Sustainable packaging (Environmental footprints and eco-design of products and processes)
紙図書
Subramanian Senthilkannan Muthu, editorSpringer[2021]<DL741-D1>
国立国会図書館
  • 要約等...lity issues of packaging. Packaging and the packaging s...
  • 内容細目...t of the Water Packaging. The Italian Assessment 5.1 Eu...

Handbook of aseptic processing and packaging Third edition

Handbook of aseptic processing and packaging Third edition
紙図書
edited by Jairus R.D. David, Pablo M. Coronel, Josip SimunovicCRC Press2023<PC111-D17>
国立国会図書館全国の図書館

Edible food packaging : applications, innovations and sustainability

Edible food packaging : applications, innovations and sustainability
紙図書
Amrita Poonia, Tejpal Dhewa, editorsSpringer[2022]<PC111-D13>
国立国会図書館
  • 要約等...oxidant edible packaging. This book also discusses abou...
  • 件名...oatings. Food--Packaging.

Sustainable food packaging technology

Sustainable food packaging technology
紙図書
edited by Athanassia AthanassiouWiley-VCH[2021]<PC111-D9>
国立国会図書館全国の図書館

Food packaging : advanced materials, technologies, and innovations First edition

Food packaging : advanced materials, technologies, and innovations First edition
紙図書
edited by Sanjay Mavinkere Rangappa, Jyotishkumar Parameswaranpillai, Senthil Muthu Kumar Thiagamani, Senthilkumar Krishnasamy, Suchart SiengchinCRC Press2021<PC111-D8>
国立国会図書館全国の図書館
  • 要約等...pments in food packaging. The book prese......r materials in packaging. It also describes biodegradab...

Food packaging : innovations and shelf-life

Food packaging : innovations and shelf-life
紙図書
editor, Rui M.S. Cruz.CRC Press[2020]<PC111-D3>
国立国会図書館
  • 件名Food--Packaging. Food--Packaging--Technologica...

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.

Proceedings of the ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems--2018-- : presented at ASME international technical conference and exhibition on packaging and integration of electronic and photonic microsystems : August 27-30, 2018 : San Francisco, California, USA : InterPACK : robotics, maker, and additively manufactured heat sink workshops : InterPACK2018 : Aug 2018, San Francisco, CA.
紙図書
The American Society of Mechanical Engineers[2019]<M17-20-1069>
国立国会図書館
  • 件名Electronic packaging--Congresses. Electronic packaging. IPACK2018

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications

Encyclopedia of thermal packaging : a guide to cooling of electeronic equipment. Set 3 Thermal packaging applications
紙図書
editor-in-chief, Avram Bar-Cohen.World Scientific Publishing Co. Pte. Ltd.[2019]<ND351-B96>
国立国会図書館
  • 件名Electronic packaging. Electronic apparatus and appliances--Packaging.

Polymeric materials for electronic packaging

Polymeric materials for electronic packaging
紙図書
Shozo NakamuraIEEE Press[2023]<ND92-D4>
国立国会図書館全国の図書館

Nano-bio-electronic, photonic and MEMS packaging Second edition

Nano-bio-electronic, photonic and MEMS packaging Second edition
紙図書
C.P. (Ching-Ping) Wong, Kyoung-sik (Jack) Moon, editorsSpringer[2021]<M213-D125>
国立国会図書館
  • 要約等...aterial device packaging. This second ed......tors and their packaging. Nano- Bio- Electronic, Photon...

Innovative packaging of fruits and vegetables : strategies for safety and quality maintenance (Postharvest biology and technology)

Innovative packaging of fruits and vegetables : strategies for safety and quality maintenance (Postharvest biology and technology)
紙図書
edited by Mohammed Wasim Siddiqui, Mohammad Shafiur Rahman, Ali Abas Wani.Apple Academic Press[2018]<PC111-D2>
国立国会図書館
  • 件名Food--Packaging. Food--Packaging--Quality cont...
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