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Avoiding inelastic strains in solder joint interconnections of IC devices : hbk

Avoiding inelastic strains in solder joint interconnections of IC devices : hbk
紙図書
authored by Ephraim SuhirCRC Press, Taylor & Francis Group2021
全国の図書館
  • 件名... -- Protection Solder and soldering -- Mechanical properties -- Mathematical models Failure analysis (Engineering...
  • 件名（識別子）... -- Protection Solder and soldering -- Mechanical properties -- Mathematical models Failure analysis (Engineering...

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