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IEEE Transactions on Electronics Packaging Manufacturing

IEEE Transactions on Electronics Packaging Manufacturing
PaperRecording Media雑誌雑誌タイトル
Institute of Electrical and Electronics Engineers<Z54-J77>
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Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils

Scalability of Roll-to-Roll Gravure-Printed Electrodes on Plastic Foils
Digital記事
2010-10IEEE Transactions on Electronics Packaging Manufacturing33 4p.275-283
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Effects of Vacuum Ultraviolet Surface Treatment on the Bonding Interconnections for Flip Chip and 3-D Integration

Effects of Vacuum Ultraviolet Surface Treatment on the Bonding Interconnections for Flip Chip and 3-D Integration
Digital記事
2010-07IEEE Transactions on Electronics Packaging Manufacturing33 3p.212-220
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Formation and Growth of Intermetallic Compounds in Cu–Au and Au–Al Systems for Copper on Gold Bonding

Formation and Growth of Intermetallic Compounds in Cu–Au and Au–Al Systems for Copper on Gold Bonding
Digital記事
2010-07IEEE Transactions on Electronics Packaging Manufacturing33 3p.228-235
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Correlation Between Whisker Initiation and Compressive Stress in Electrodeposited Tin–Copper Coating on Copper Leadframes

Correlation Between Whisker Initiation and Compressive Stress in Electrodeposited Tin–Copper Coating on Copper Leadframes
Digital記事
2010-07IEEE Transactions on Electronics Packaging Manufacturing33 3p.165-176
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films

Defect Morphology and Texture in Sn, Sn–Cu, and Sn–Cu–Pb Electroplated Films
Digital記事
2010-07IEEE Transactions on Electronics Packaging Manufacturing33 3p.159-164
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Effect of Grain Size on Pressure-Induced Tin Whisker Formation

Effect of Grain Size on Pressure-Induced Tin Whisker Formation
Digital記事
2010-07-01IEEE Transactions on Electronics Packaging Manufacturing33p.177-182
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Application of the Underfill Model to Bump Arrangement and Dispensing Process Design

Application of the Underfill Model to Bump Arrangement and Dispensing Process Design
Digital記事
2010-04IEEE Transactions on Electronics Packaging Manufacturing33 2p.122-128
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope

The Bond Strength of Au/Si Eutectic Bonding Studied by IR Microscope
Digital記事
2010-01IEEE Transactions on Electronics Packaging Manufacturing33 1p.31-37
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Tin Whisker Test Development—Temperature and Humidity Effects Part II: Acceleration Model Development

Tin Whisker Test Development—Temperature and Humidity Effects Part II: Acceleration Model Development
Digital記事
2010-01IEEE Transactions on Electronics Packaging Manufacturing33 1p.16-24
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Flexible Electronics: Thin Silicon Die on Flexible Substrates

Flexible Electronics: Thin Silicon Die on Flexible Substrates
Digital記事
2009-10IEEE Transactions on Electronics Packaging Manufacturing32 4p.291-300
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling

Cross-Section Preparation for Solder Joints and MEMS Device Using Argon Ion Beam Milling
Digital記事
2009-10IEEE Transactions on Electronics Packaging Manufacturing32 4p.265-271
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy

Constitutive and Aging Behavior of Sn3.0Ag0.5Cu Solder Alloy
Digital記事
2009-10IEEE Transactions on Electronics Packaging Manufacturing32 4p.221-232
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Simplified Measuring Method of Copper Concentration in Solder Bath Utilizing Copper Dissolution

Simplified Measuring Method of Copper Concentration in Solder Bath Utilizing Copper Dissolution
Digital記事
2009-07IEEE Transactions on Electronics Packaging Manufacturing32 3p.138-143
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device

Wafer-Level Package With Simultaneous TSV Connection and Cavity Hermetic Sealing by Solder Bonding for MEMS Device
Digital記事
2009-07IEEE Transactions on Electronics Packaging Manufacturing32 3p.125-132
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Low-Stress Thermosonic Copper Ball Bonding

Low-Stress Thermosonic Copper Ball Bonding
Digital記事
2009-07IEEE Transactions on Electronics Packaging Manufacturing32 3p.176-184
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Statistical Analysis of Transponder Packaging in UHF RFID Systems

Statistical Analysis of Transponder Packaging in UHF RFID Systems
Digital記事
2009-04IEEE Transactions on Electronics Packaging Manufacturing32 2p.97-105
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions

Design of Experiments for Board-Level Solder Joint Reliability of PBGA Package Under Various Manufacturing and Multiple Environmental Loading Conditions
Digital記事
2009-01IEEE Transactions on Electronics Packaging Manufacturing32 1p.32-40
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly

Coupled Power and Thermal Cycling Reliability of Board-Level Package-on-Package Stacking Assembly
Digital記事
2009-01IEEE Transactions on Electronics Packaging Manufacturing32 1p.14-21
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X

Void Formation Study of Flip Chip in Package Using No-Flow Underfill

Void Formation Study of Flip Chip in Package Using No-Flow Underfill
Digital記事
2008-10IEEE Transactions on Electronics Packaging Manufacturing31 4p.297-305
Other Libraries in Japan
  • Periodical Title (ISSN)1521334X
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