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MCM-C MULTICHIP MODULE MANUFACTURING GUIDE. (KCP ; KCP-613-6384; DE2001-768060)

MCM-C MULTICHIP MODULE MANUFACTURING GUIDE. (KCP ; KCP-613-6384; DE2001-768060)
Paper図書
BLAZEK, R.J.(et al.)2000.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

AUTOMATED HMC ASSEMBLY. (KCP ; KCP-613-5079)

AUTOMATED HMC ASSEMBLY. (KCP ; KCP-613-5079)
Paper図書
BLAZEK, R.J.1993.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

MICROELECTRONICS PACKAGING AUTOMATION. (KCP ; KCP-613-4968)

MICROELECTRONICS PACKAGING AUTOMATION. (KCP ; KCP-613-4968)
Paper図書
BLAZEK, R.J.1992.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

WIRE INTERCONNECTION RELIABILITY AND MOISTURE LEVELS IN HYBRID MICROCIRCUITS WITH EPOXY-ATTACHED COMPONENTS. (BDX ; BDX-613-3721)

WIRE INTERCONNECTION RELIABILITY AND MOISTURE LEVELS IN HYBRID MICROCIRCUITS WITH EPOXY-ATTACHED COMPONENTS. (BDX ; BDX-613-3721)
Paper図書
BLAZEK, R.J.1987.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

DEVELOPMENT OF NONDESTRUCTIVE PULL TEST REQUIREMENTS FOR GOLD WIRES ON MULTILAYER THICK-FILM HYBRID MICROCIRCUITS. (BDX ; BDX-613-2859R)

DEVELOPMENT OF NONDESTRUCTIVE PULL TEST REQUIREMENTS FOR GOLD WIRES ON MULTILAYER THICK-FILM HYBRID MICROCIRCUITS. (BDX ; BDX-613-2859R)
Paper図書
BLAZEK, R.J.1983.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

IMPROVEMENT OF EXTERNAL LEAD BOND AND FLEXURE STRENGTHS BY COMPARING LEAD BASE MATERIALS. (BDX ; BDX-613-2339)

IMPROVEMENT OF EXTERNAL LEAD BOND AND FLEXURE STRENGTHS BY COMPARING LEAD BASE MATERIALS. (BDX ; BDX-613-2339)
Paper図書
BLAZEK, R.J.(et al.)1980.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

LEAD FRAME BONDER MODIFICATIONS FOR MORE UNIFORM PRODUCTION BONDING. (BDX ; BDX-613-2246)

LEAD FRAME BONDER MODIFICATIONS FOR MORE UNIFORM PRODUCTION BONDING. (BDX ; BDX-613-2246)
Paper図書
BLAZEK, R.J.(et al.)1979.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

OPTIMIZATION OF LEAD FRAME BOND PARAMETERS FOR PRODUCTION OF RELIABLE THERMOCOMPRESSION BONDS. (BDX ; BDX-613-1969)

OPTIMIZATION OF LEAD FRAME BOND PARAMETERS FOR PRODUCTION OF RELIABLE THERMOCOMPRESSION BONDS. (BDX ; BDX-613-1969)
Paper図書
BLAZEK, R.J.(et al.)1978.
Other Libraries in Japan
  • Author HeadingBLAZEK, R.J.

Development of processes for hybrid microcircuits containing beam-lead devices (BDX ; BDX-613-1115(Rev.))

Development of processes for hybrid microcircuits containing beam-lead devices (BDX ; BDX-613-1115(Rev.))
Paper図書
R.J. Blazek, J.N. BlakelyBendix Corp.1974.8.
Other Libraries in Japan
  • Author HeadingBlazek, R.J. Blakely, J.N.

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