Jump to main content

yr 〜
yr

Search results 4

Thermo-mechanical behavior of solder column interconnections under highly accelerated thermal cycling condition ASME-96-WA/EEP-16

Thermo-mechanical behavior of solder column interconnections under highly accelerated thermal cycling condition ASME-96-WA/EEP-16
Paper規格・テクニカルリポート類
Han, Bongtae, Cole, Marie S1996<M-ASME-96-WA/EEP-16>
National Diet Library

Thermal deformation analysis of various electronic packaging products by moire and microscopic moire interferometry ASME-94-WA/EEP-7

Thermal deformation analysis of various electronic packaging products by moire and microscopic moire interferometry ASME-94-WA/EEP-7
Paper規格・テクニカルリポート類
Han, Bongtae, Guo, Yifan1994<M-ASME-94-WA/EEP-7>
National Diet Library

High sensitivity moiré : experimental analysis for mechanics and materials :us :gw

High sensitivity moiré : experimental analysis for mechanics and materials :us :gw
Paper図書
Daniel Post, Bongtae Han, Peter IfjuSpringer-Verlagc1994
Other Libraries in Japan
  • Author HeadingPost, Daniel Han, Bongtae Ifju, Peter

High sensitivity moiré : experimental analysis for mechanics and materials : pbk

High sensitivity moiré : experimental analysis for mechanics and materials : pbk
Paper図書
Daniel Post, Bongtae Han, Peter IfjuSpringer-Verlagc1994
Other Libraries in Japan
  • Author HeadingPost, Daniel Han, Bongtae Ifju, Peter

Reached to the end of result.

RSS