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Electromigration in thin films and electronic devices : materials and reliability (Woodhead Publishing in materials)

Electromigration in thin films and electronic devices : materials and reliability (Woodhead Publishing in materials)
Paper図書
edited by Choong-Un Kim.Woodhead Publishing2011<ND386-B30>
National Diet Library
  • Author HeadingKim, Choong-Un.

Electromigration in thin films and electronic devices : materials and reliability : hardcover

Electromigration in thin films and electronic devices : materials and reliability : hardcover
Paper図書
edited by Choong-Un KimWoodhead Publishingc2011
Other Libraries in Japan
  • Author HeadingKim, Choong-Un

MECHANISM OF ELECTROMIGRATION FAILURE IN AL THIN FILM INTERCONNECTS CONTAINING SC (UCRL ; UCRL-JC-120337)

MECHANISM OF ELECTROMIGRATION FAILURE IN AL THIN FILM INTERCONNECTS CONTAINING SC (UCRL ; UCRL-JC-120337)
Paper図書
KIM, CHOONG-UN// KANG, S.H.// MORRIS, J.W. JR.// GENIN, F.Y. (LAWRENCE LIVERMORE NATIONAL LAB., CA (UNITED STATES))University of California Research Laboratory(University of California Research Laboratory)1995.
Other Libraries in Japan
  • Author HeadingKIM, CHOONG-UN KANG, S.H. MORRIS, J.W. JR. G...

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