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Copper wire bonding

Copper wire bonding
Paper図書
Preeti S. Chauhan ... [et al.]Springerc2014
Other Libraries in Japan
  • Author HeadingChauhan, Preeti S. Choubey, Anupam Zhong, ZhaoWei Pecht, Michael G.

Influence of temperature on microelectronics and system reliability

Influence of temperature on microelectronics and system reliability
Paper図書
Pradeep Lall, Michael G. Pecht, Edward B. HakimCRC Pressc1997
Other Libraries in Japan
  • Author HeadingLall, Pradeep Pecht, Michael G. Hakim, Edward B.

Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993

Electronic packaging reliability : presented at the 1993 ASME Winter Annual Meeting, New Orleans, Louisiana, November 28-December 3, 1993
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by L. T. Nguyen, M.G. PechtAmerican Society of Mechanical Engineersc1993
Other Libraries in Japan
  • Author Heading...Nguyen, Luu T. Pecht, Michael G.

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