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Ultrasonic nondestructive characterization of adhesive bonds [microform] : annual performance report, period covered--12/23/96-12/22/97, grant number--NAG-1-1810 / [principal investigator], Jianmin Qu ([NASA contractor report] ; 206473)

Ultrasonic nondestructive characterization of adhesive bonds [microform] : annual performance report, period covered--12/23/96-12/22/97, grant number--NAG-1-1810 / [principal investigator], Jianmin Qu ([NASA contractor report] ; 206473)
Microform図書
1997<YCA-NAS 1.26:206473>
National Diet Library
  • Author HeadingQu, Jianmin United States. National Aeron...

Fundamentals of micromechanics of solids

Fundamentals of micromechanics of solids
Paper図書
Jianmin Qu, Mohammed CherkaouiJ. Wileyc2006
Other Libraries in Japan
  • Author HeadingQu, Jianmin Cherkaoui, Mohammed

ULTRASONIC NONDESTRUCTIVE CHARACTERIZATION OF ADHESIVE BONDS FINAL REPORT (19990046400)

ULTRASONIC NONDESTRUCTIVE CHARACTERIZATION OF ADHESIVE BONDS FINAL REPORT (19990046400)
Paper図書
QU, JIANMIN (GEORGIA INST. OF TECH.)1999.
Other Libraries in Japan
  • Author HeadingQU, JIANMIN

2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA

2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA
Paper図書
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh SitaramanIEEE Service Centerc2004
Other Libraries in Japan
  • Author Heading...crointegration Qu, Jianmin Savolainen, Petri Sitaraman, ...

2002 proceedings, 8th International Advanced Packaging Materials Symposium, March 3-6, 2002, Stone Mountain, GA, USA

2002 proceedings, 8th International Advanced Packaging Materials Symposium, March 3-6, 2002, Stone Mountain, GA, USA
Paper図書
sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) , Packaging Research Center at Georgia Tech(USA) ; technical sponsors, Fraunhofer IZM(Germany), Material Research Society ; general chair, Rajen Chanchan ; general chair elect, Andras Schubert ; technical chair, Jianmin Qu ; technical chair elect, Petri SavolainenIEEE Service Centerc2002
Other Libraries in Japan
  • Author Heading...hubert, Andras Qu, Jianmin Savolainen, Petri

Nondestructive evaluation and characterization of engineering materials for reliability and durability predictions : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000 Orlando, Florida

Nondestructive evaluation and characterization of engineering materials for reliability and durability predictions : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November 5-10, 2000 Orlando, Florida
Paper図書
sponsored by the Applied Mechanics Division, ASME,the NDE Engineering Division, ASME ; edited by Jianmin Qu, Tribikram KunduAmerican Society of Mechanical Engineersc2000
Other Libraries in Japan
  • Author HeadingQu, Jianmin Kundu, Tribikram Internationa...

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