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Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA

Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January, 2007, San Jose, California, USA
Paper図書
Allyson L. Hartzell, Rajeshuni Ramesham, chairs/editors ; sponsored and published by SPIE--the International Society for Optical EngineeringSPIEc2007
Other Libraries in Japan
  • Alternative TitleReliability, packaging, testing, and characterization of MEMS/MOEMS 6 Reliability, packaging, testing, and characterization of MEMS/MOEMS six
  • Alternative TitleReliability, packaging, testing, and characterization of MEMS/MOEMS 6 Reliability, packaging, testing, and characterization of MEMS/MOEMS six
  • Author HeadingReliability, Packaging, Testing, and Characterization of MEMS/MOEMS Hartzell, Allyson L. Ramesham...

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