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Wire bonding in microelectronics : materials, processes, reliability, and yield 2nd ed

Wire bonding in microelectronics : materials, processes, reliability, and yield 2nd ed
Paper図書
George G. HarmonMcGraw-Hillc1997
Other Libraries in Japan
  • Subject Heading...-- Reliabiligy Electronic packaging -- Defects Semiconductors -- Failure
  • Subject Heading (ID)...-- Reliabiligy Electronic packaging -- Defects Semiconductors -- Failure

Quality conformance and qualification of microelectronic packages and interconnects : alk. paper

Quality conformance and qualification of microelectronic packages and interconnects : alk. paper
Paper図書
edited by Michael Pecht ... [et al.]Wileyc1994
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Defects Electronic packaging -- Quali...
  • Subject Heading (ID)Electronic packaging -- Defects Electronic packaging -- Quali...

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