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2015 IEEE electrical design of advanced packaging and systems symposium (EDAPS 2015) : Seoul, South Korea : 14-16 December 2015 : Dec 2015, Seoul, Korea.

2015 IEEE electrical design of advanced packaging and systems symposium (EDAPS 2015) : Seoul, South Korea : 14-16 December 2015 : Dec 2015, Seoul, Korea.
Paper図書
IEEE[2015]<M17-17-720>
National Diet Library

2014 IEEE electrical design of advanced packaging & systems symposium : (EDAPS 2014) : Bangalore, India : 14-16 December 2014 : Dec 2014, Bangalore, India. FP14EDP-ART

2014 IEEE electrical design of advanced packaging & systems symposium : (EDAPS 2014) : Bangalore, India : 14-16 December 2014 : Dec 2014, Bangalore, India. FP14EDP-ART
Paper図書
IEEE[2014]<M17-16-1320>
National Diet Library

2015 IEEE 21st international symposium for design and technology in electronic packaging (SIITME 2015) : Brasov, Romania : 22-25 October 2015 : 2015 IEEE 21st international symposium for design and technology of electronics packaging : SIITME event : SIITME 2015 conference : SIITME2015 : Oct 2015, Brasov, Romania.

2015 IEEE 21st international symposium for design and technology in electronic packaging (SIITME 2015) : Brasov, Romania : 22-25 October 2015 : 2015 IEEE 21st international symposium for design and technology of electronics packaging : SIITME event : SIITME 2015 conference : SIITME2015 : Oct 2015, Brasov, Romania.
Paper図書
IEEE[2015]<M17-17-641>
National Diet Library

2016 IEEE electrical design of advanced packaging and systems : (EDAPS 2016) : Honolulu, Hawaii, USA : 14-16 December 2016 : electrical design of advanced packaging & systems (EDAPS) symposium : Dec 2016, Honolulu, HI.

2016 IEEE electrical design of advanced packaging and systems : (EDAPS 2016) : Honolulu, Hawaii, USA : 14-16 December 2016 : electrical design of advanced packaging & systems (EDAPS) symposium : Dec 2016, Honolulu, HI.
Paper図書
IEEE[2016]<M17-18-1864>
National Diet Library

2016 IEEE 22nd international symposium for design and technology in electronic packaging (SIITME 2016) : Oradea, Romania : 20-23 October 2016 : SIITME 2016 conference : SIITME2016 : Oct 2016, Oradea, Romania.

2016 IEEE 22nd international symposium for design and technology in electronic packaging (SIITME 2016) : Oradea, Romania : 20-23 October 2016 : SIITME 2016 conference : SIITME2016 : Oct 2016, Oradea, Romania.
Paper図書
IEEE[2016]<M17-18-363>
National Diet Library

Area array package design : techniques in high-density electronics

Area array package design : techniques in high-density electronics
Paper図書
Ken Gilleo, editorMcGraw-Hillc2004
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Design
  • Subject Heading (ID)Electronic packaging -- Design

Electronics packaging forum : multichip module technology issues

Electronics packaging forum : multichip module technology issues
Paper図書
edited by James E. MorrisIEEE Pressc1994
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Design Multichip modules (Microelect...
  • Subject Heading (ID)Electronic packaging -- Design Multichip modules (Microelect...

Physical design for multichip modules

Physical design for multichip modules
Paper図書
by M. Sriram, S.M. KangKluwer Academic Publishersc1994
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Design Multichip modules (Microelect...
  • Subject Heading (ID)Electronic packaging -- Design Multichip modules (Microelect...

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability

Integrated circuit, hybrid, and multichip module package design guidelines : a focus on reliability
Paper図書
[edited by] Michael PechtWileyc1994
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Design Hybrid integrated circuits --...
  • Subject Heading (ID)Electronic packaging -- Design Hybrid integrated circuits --...

Computer aided design in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992

Computer aided design in electronic packaging : presented at the Winter Annual Meeting of the American Society of Mechanical Engineers, Anaheim, California, November 8-13, 1992
Paper図書
sponsored by the Electrionic Packaging Division, ASME ; edited by Dereje Agonafer, Robert E. FultonAmerican Society of Mechanical Engineersc1992
Other Libraries in Japan
  • Subject HeadingElectronic packaging -- Design -- Data processing -- Congres...
  • Subject Heading (ID)Electronic packaging -- Design -- Data processing -- Congres...

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas

CAE/CAD and thermal management issues in electronic systems : presented at the 1997 ASME International Mechanical Engineering Congress and Exposition, November 16-21, 1997, Dallas, Texas
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by Dereje Agonafer ... [et al.]American Society of Mechanical Engineersc1997
Other Libraries in Japan
  • Subject Heading... -- Congresses Electronic packaging -- Design -- Data processing -- Congres...
  • Subject Heading (ID)... -- Congresses Electronic packaging -- Design -- Data processing -- Congres...

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