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Combustion, fire, and computational modeling of industrial combustion systems : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida

Combustion, fire, and computational modeling of industrial combustion systems : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida
Paper図書
sponsored by the Fuels and Combustion Technologies Division, ASME, the Heat Transfer Division, ASME ; edited by Cary Presser, Ashwani K. GuptaAmerican Society of Mechanical Engineersc2000
Other Libraries in Japan
  • Subject HeadingElectronic packaging Congresses
  • Subject Heading (ID)Electronic packaging Congresses

Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida

Packaging of electronic and photonic devices : presented at the 2000 ASME International Mechanical Engineering Congress and Exposition, November, 5-10, 2000, Orlando, Florida
Paper図書
sponsored by the Electrical and Electronic Packaging Division, ASME ; edited by G. J. Kowalski ... [et al.]American Society of Mechanical Engineersc2000
Other Libraries in Japan
  • Subject HeadingElectronic packaging Congresses
  • Subject Heading (ID)Electronic packaging Congresses

Proceedings of 2nd Electronics Packaging Technology Conferenc : [8-10 December, 1998, Raffles City Convention Center, Singapore] : soft. : case.

Proceedings of 2nd Electronics Packaging Technology Conferenc : [8-10 December, 1998, Raffles City Convention Center, Singapore] : soft. : case.
Paper図書
edited by Andrew A.O. Tay, Lim Thian Beng ; organised by IEEE Reliability/CPMT/ED Singapore Chapter ... [et al.]IEEEc1998
Other Libraries in Japan
  • Subject HeadingElectronic packaging Congresses
  • Subject Heading (ID)Electronic packaging Congresses

Proceedings : 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing : presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000

Proceedings : 4th International Conference on Adhesive Joining and Coating Technology in Electronics Manufacturing : presented at Adhesives in Electronics 2000, Espoo, Finland, June 18-21, 2000
Paper図書
conference chair, Jorma Kivilahti ; proceedings editor, Marika Hyytiäinen ; sponsored by NOKIA ... [et al.]IEEEc2000
Other Libraries in Japan
  • Subject HeadingElectronic packaging Congresses Electronic packaging -- Mater...
  • Subject Heading (ID)Electronic packaging Congresses Electronic packaging -- Mater...

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