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Proceedings : fourth IEEE International Symposium on Electronic Design, Test, and Applications, 23-25 January 2008, Hong Kong, SAR, China

Proceedings : fourth IEEE International Symposium on Electronic Design, Test, and Applications, 23-25 January 2008, Hong Kong, SAR, China
Paper図書
editors, Adam Osseiran ... [et al.] ; sponsored by IEEE Computer Society Test Technology Technical Council (TTTC), IEEE Hong Kong ED/SSC Joint Chapter, Hong Kong University of Science and TechnologyIEEE Computer Societyc2008
Other Libraries in Japan
  • Subject Heading... -- Congresses Microelectronics -- Testing -- Congresses
  • Subject Heading (ID)... -- Congresses Microelectronics -- Testing -- Congresses

Analysis of microelectronic materials and devices

Analysis of microelectronic materials and devices
Paper図書
edited by M. Grasserbauer and H.W. WernerWileyc1991
Other Libraries in Japan
  • Subject HeadingMicroelectronics -- Materials -- Testing Microstructure Microelectronics -- Testing
  • Subject Heading (ID)Microelectronics -- Materials -- Testing Microstructure Microelectronics -- Testing

Multi-chip module test strategies acid-free paper

Multi-chip module test strategies acid-free paper
Paper図書
edited by Yervant ZorianKluwerc1997
Other Libraries in Japan

Proceedings : third IEEE International Workshop on Electronic Design, Test, and Applications, 17-19 January 2006, Kuala Lumpur, Malaysia

Proceedings : third IEEE International Workshop on Electronic Design, Test, and Applications, 17-19 January 2006, Kuala Lumpur, Malaysia
Paper図書
edited by Patrick Girard, Adam Osseiran, and Moi-Tin Chew ; sponsored by IEEE Computer Society Test Technology Technical Council (TTTC), IEEE Malaysia Section, Monash University, Malaysia ; with industrial co-sponsorship from National Instruments ; in cooperation with Freescale Semiconductor Malaysia ... [et al.]IEEE Computer Societyc2006
Other Libraries in Japan
  • Subject Heading... -- Congresses Microelectronics -- Testing -- Congresses
  • Subject Heading (ID)... -- Congresses Microelectronics -- Testing -- Congresses

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc

Solder joint reliability of BGA, CSP, flip chip, and fine pitch SMT assemblies : hc
Paper図書
John H. Lau, Yi-Hsin PaoMcGraw-Hillc1997
Other Libraries in Japan

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