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Fatigue life prediction of solder joints in electronic packages with ANSYS

Fatigue life prediction of solder joints in electronic packages with ANSYS
Paper図書
by Erdogan Madenci, Ibrahim Guven, Bahattin KilicKluwer Academicc2003
Other Libraries in Japan
  • Subject Heading...als -- Fatigue Service life (Engineering) -- Forecasting ANSYS (Computer system)
  • Subject Heading (ID)...als -- Fatigue Service life (Engineering) -- Forecasting ANSYS (Computer system)

Recombination lifetime measurements in silicon

Recombination lifetime measurements in silicon
Paper図書
Dinesh C. Gupta, Fred R. Bacher, and William H. Hughes, editorsASTMc1998
Other Libraries in Japan
  • Subject Heading... -- Congresses Service life (Engineering) -- Forecasting -- Congresses Electronic meas...
  • Subject Heading (ID)... -- Congresses Service life (Engineering) -- Forecasting -- Congresses Electronic meas...

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