Jump to main content

yr 〜
yr

Search results 134

Encyclopedia of thermal stresses (Springer reference)

Encyclopedia of thermal stresses (Springer reference)
Paper図書
Richard B. Hetnarski, editor.Springer[2014]<X>
National Diet Library
  • Contents... stress v. 10. Thermal stresses--Thermoelastic v. 11. Thermoe...
  • Subject HeadingThermal stresses--Encyclopedias.
  • Alternative TitleThermal stresses

Thermal stresses : advanced theory and applications : hbk 2nd ed

Thermal stresses : advanced theory and applications : hbk 2nd ed
Paper図書
Richard B. Hetnarski, M. Reza EslamiSpringerc2019
Other Libraries in Japan
  • Subject HeadingThermal stresses
  • Subject Heading (ID)Thermal stresses

引張、曲げ荷重及び熱負荷を受ける鎌継手の応力解析及び形状最適化に関する研究

引張、曲げ荷重及び熱負荷を受ける鎌継手の応力解析及び形状最適化に関する研究
Digital博士論文障害者向け資料あり
中村, 匠中央大学理工学部事務室2021-03-24
National Diet Library

構造物の熱応力解析とその逆解析

構造物の熱応力解析とその逆解析
Paper図書
松井邦人, 東京電機大学1997-1998<Y151-H09045059>
National Diet Library

Thermal deformation in machine tools / edited by Yoshimi Ito.

Thermal deformation in machine tools / edited by Yoshimi Ito.
Paper図書
McGraw-Hillc2010.<NB53-B2>
National Diet Library
  • Subject HeadingMachine-tools -- Materials. Thermal stresses. Metals -- Ductility. Metals ...

Thermal stresses / Naotake Noda, Richard B. Hetnarski, Yoshinobu Tanigawa. 2nd ed.

Thermal stresses / Naotake Noda, Richard B. Hetnarski, Yoshinobu Tanigawa. 2nd ed.
Paper図書
Taylor & Francis2003.<M233-B8>
National Diet Library
  • Subject HeadingThermal stresses. Isı gerilmeleri.

LOW THERMAL EXPANSION OF ELECTRODEPOSITED COPPER IN THROUGH SILICON VIAS

LOW THERMAL EXPANSION OF ELECTRODEPOSITED COPPER IN THROUGH SILICON VIAS
Digital博士論文障害者向け資料あり
DINH, VAN QUY2020-05-25
Available onlineNational Diet LibraryOther Libraries in Japan

熱応力による変形・破壊の評価方法と対策事例 : デモ展示付き : 関西支部第286回講習会 : 教材

熱応力による変形・破壊の評価方法と対策事例 : デモ展示付き : 関西支部第286回講習会 : 教材
Paper図書
[日本機械学会関西支部]2006.10<M233-H46>
National Diet Library
  • Authority（Subject Heading/altLabel）Thermal stresses

熱応力による変形・破壊の評価方法と対策事例 : デモ展示付き : 関西支部第298回講習会 : 教材

熱応力による変形・破壊の評価方法と対策事例 : デモ展示付き : 関西支部第298回講習会 : 教材
Paper図書
[日本機械学会関西支部]2008.10<M233-J30>
National Diet Library
  • Authority（Subject Heading/altLabel）Thermal stresses

PWR炉心支持構造物のメッシュ細分化熱応力解析

PWR炉心支持構造物のメッシュ細分化熱応力解析
Paper図書
原子力安全基盤機構2006.8<NG41-H614>
National Diet Library
  • Authority（Subject Heading/altLabel）Thermal stresses

溶接残留応力評価システムの構築

溶接残留応力評価システムの構築
Paper図書
原子力安全基盤機構2006.9<NG41-H648>
National Diet Library
  • Authority（Subject Heading/altLabel）Nuclear reactors Thermal stresses

溶接部の残留応力に着目したSCCへの力学的影響に関する研究 : 平成18年度原子力安全基盤調査研究

溶接部の残留応力に着目したSCCへの力学的影響に関する研究 : 平成18年度原子力安全基盤調査研究
Paper図書
大阪大学2007.3<NG41-H671>
National Diet Library
  • Authority（Subject Heading/altLabel）Nuclear reactors SCC Stress corrosion Thermal stresses

Theory of elasticity and thermal stresses : explanations, problems and solutions

Theory of elasticity and thermal stresses : explanations, problems and solutions
Paper図書
M. Reza Eslami ... [et al.]Springerc2013
Other Libraries in Japan
  • Subject HeadingElasticity -- Mathematics Elasticity Thermal stresses -- Mathematics Thermal stresses
  • Subject Heading (ID)Elasticity -- Mathematics Elasticity Thermal stresses -- Mathematics Thermal stresses

Design for thermal stresses : hbk

Design for thermal stresses : hbk
Paper図書
Randall F. Barron, Brian R. BarronWileyc2012
Other Libraries in Japan
  • Subject HeadingThermal stresses
  • Subject Heading (ID)Thermal stresses

Residual stresses in thermal barrier coatings for a Cu-8Cr-4Nb substrate system [microform] / Louis J. Ghosn, Sai V. Raj ECD4-A-09-2002 (NASA/TM-2002-211561)

Residual stresses in thermal barrier coatings for a Cu-8Cr-4Nb substrate system [microform] / Louis J. Ghosn, Sai V. Raj ECD4-A-09-2002 (NASA/TM-2002-211561)
Microform図書
2002<YCA-NAS 1.15:2002-211561>
National Diet Library
  • Subject Heading...lasma spraying Thermal stresses Coating

Skin temperatures during unaided egress [microform] : unsuited and while wearing the NASA Launch and Entry or Advanced Crew Escape suits / Kristin K. Woodruff ... [et al.] ([NASA technical memorandum] ; NASA/TM-2000-209761)

Skin temperatures during unaided egress [microform] : unsuited and while wearing the NASA Launch and Entry or Advanced Crew Escape suits / Kristin K. Woodruff ... [et al.] ([NASA technical memorandum] ; NASA/TM-2000-209761)
Microform図書
2000<YCA-NAS 1.15:209761>
National Diet Library
  • Subject HeadingEgress Garments Heat storage Liquid cooling Thermal stresses Performance tests

International comparative assessment study of pressurized thermal shock in reactor pressure vessels [microform] / prepared by B.R. Bass ... [et al.]

International comparative assessment study of pressurized thermal shock in reactor pressure vessels [microform] / prepared by B.R. Bass ... [et al.]
Microform図書
1999<YCA-Y 3.N 88:25/6651>
National Diet Library
  • Subject HeadingNuclear pressure vessels -- Cracking Fracture mechanics Thermal stresses

A review of large-scale fracture experiments relevant to pressure vessel integrity under pressurized thermal shock conditions [microform] / prepared by C.E. Pugh, B.R. Bass

A review of large-scale fracture experiments relevant to pressure vessel integrity under pressurized thermal shock conditions [microform] / prepared by C.E. Pugh, B.R. Bass
Microform図書
2001<YCA-Y 3.N 88:25/6699>
National Diet Library
  • Subject Heading...ture mechanics Thermal stresses

Rapid prototyping of composite structures [microform] : annual performance report, performance period 7/14/97 to 6/30/98 : NASA LaRC #NLPN 97-620, GT # E25-A55 / PI, Jonathan S. Colton ([NASA contractor report] ; NASA/CR-1998-207816)

Rapid prototyping of composite structures [microform] : annual performance report, performance period 7/14/97 to 6/30/98 : NASA LaRC #NLPN 97-620, GT # E25-A55 / PI, Jonathan S. Colton ([NASA contractor report] ; NASA/CR-1998-207816)
Microform図書
1998<YCA-NAS 1.26:207816>
National Diet Library
  • Subject HeadingComposite structures Epoxy matrix composites Carbon fibers Thermal stresses

電子材料・実装技術における熱応力の解析・制御とトラブル対策 : 低熱膨張・高耐熱性エレクトロニクス関連材料の開発

電子材料・実装技術における熱応力の解析・制御とトラブル対策 : 低熱膨張・高耐熱性エレクトロニクス関連材料の開発
Paper図書
技術情報協会2006.1<ND354-H39>
National Diet Library
  • Authority（Subject Heading/altLabel）電子材料 電子デバイス Electronics--Materials Thermal stresses
RSS