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Materials for advanced packaging : hbk.

Materials for advanced packaging : hbk.
Paper図書
Daniel Lu, C.P. Wong, editorsSpringerc2009
Other Libraries in Japan

Symposia : May 1999, Seattle, WA. (PV ; 99-7)

Symposia : May 1999, Seattle, WA. (PV ; 99-7)
Paper図書
Electrochemical Society2000.<M17-00-1274>
National Diet Library
  • Note (General)...m on thin film materials for advanced packaging technologies sponsored jointl...
  • Alternative Title...m on thin film materials for advanced packaging technologies sponsored jointl...
  • Alternative Title...m on thin film materials for advanced packaging technologies sponsored jointl...

Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium

Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium
Paper図書
editors, R. Singh ... [et al.] ; [sponsord by] Dielectric Science and Technology and Electronics DivisionsElectrochemical Societyc2000
Other Libraries in Japan
  • Author Heading...m on Thin Film Materials for Advanced Packaging Singh, R. Electrochemical Soc...

Proceedings

Proceedings
Paper図書
[Electrochemical Society]Electrochemical Society
Other Libraries in Japan
  • Related Material... and Thin Film Materials for Advanced Packaging Technologies : proceedings of...

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