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Study on Residual Stress and Mechanical Behavior of intermetallic Compound Layer in Diffusion Bonding of Mg/Al Alloy

Study on Residual Stress and Mechanical Behavior of intermetallic Compound Layer in Diffusion Bonding of Mg/Al Alloy
Digital博士論文障害者向け資料あり
丁, 雲龍2018-03-17
National Diet Library

Mg /Al 合金の拡散接合における金属間化合物接合層の残留応力と力学挙動に関する研究

Mg /Al 合金の拡散接合における金属間化合物接合層の残留応力と力学挙動に関する研究
Digital博士論文
Ding, Yunlong
Available onlineOther Libraries in Japan
  • Alternative TitleStudy on Residual Stress and Mechanical Behavior of intermetallic Compound Layer in Diffusion Bonding of Mg/Al Alloy
  • Alternative TitleStudy on Residual Stress and Mechanical Behavior of intermetallic Compound Layer in Diffusion Bonding of Mg/Al Alloy

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