Copper Materials for Low Temperature Sintering
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CiNii Research
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- 資料種別
- 記事
- 著者・編者
- Masamu NishimotoRintaro TokuraMai Thanh NguyenTetsu Yonezawa
- タイトル（掲載誌）
- Materials transactions
- 巻号年月日等（掲載誌）
- 63(5):2022.5
- 掲載巻
- 63
- 掲載号
- 5
- 掲載ページ
- 663-675
- 掲載年月日（W3CDTF）
- 2022-05
- ISSN（掲載誌）
- 1345-9678
- ISSN-L（掲載誌）
- 1345-9678
- 出版事項（掲載誌）
- Sendai : The Japan Institute of Metals and Materials ; 2001-
- 出版地（国名コード）
- JP
- 本文の言語コード
- eng
- NDLC
- 対象利用者
- 一般
- 所蔵機関
- 国立国会図書館
- 請求記号
- Z53-J286
- 連携機関・データベース
- 国立国会図書館 : 国立国会図書館雑誌記事索引
- 書誌ID（NDLBibID）
- 032129409
- 整理区分コード
- 632
- 要約等
- <p>In this review paper, recent studies on low-temperature sintering strategies of copper materials for conductive layer preparation have been summarized. Coinage metals, gold, silver, and copper have been used as materials for conductive inks and pastes for printed electronics. Copper is a highly electrically and thermally conductive material that can be used in electronic circuits and die-attach materials. Recently, copper-based inks/pastes have gained significant attention of researchers and industries as conductive materials. However, copper is readily oxidized under air, especially, at the nanoscale, and copper particles may catch fire because of the rapid oxidization. To overcome this issue, copper nanoparticles and fine particles are coated with organic molecules which act as insulators after sintering. Some interesting surface treatments or activation strategies have been investigated in this regard. In this paper, different perspectives on the applications of copper in conductive and die-attach materials have been presented.</p>
- DOI
- 10.2320/matertrans.mt-n2021004
- 関連情報（URI）
- 参照
- Lowering temperature of Cu sinter bonding under low-pressure in ambient air by in-situ generation and reduction of Cu₂O nanoparticlesSelf-stacking two-layer conductive films for enhanced oxidation and low electrical resistance from hybrid ink of cobalt/copperIn Situ Rheoimpedance and Thermogravimetry–Differential Thermal Analysis of Copper-Based Conductive Inks for High-Oxidation-Resistant Performanceレビュー：銅微粒子・ナノ粒子を用いた焼結性接合材料Review: Copper Fine Particle/Nanoparticle-Based Sintering Joining Material電子部品部材に用いるナノ粒子の実用化に向けた最新研究開発動向
- 参照
- Low-temperature nanoredox two-step sintering of gelatin nanoskin-stabilized submicrometer-sized copper fine particles for preparing highly conductive layersProton-assisted low-temperature sintering of Cu fine particles stabilized by a proton-initiating degradable polymerSurfactant-stabilized copper paticles for low-temperature sintering: Paste preparation using a milling with small zirconia beads : Effect of pre-treatment with the disperse mediumLow temperature sintering process of copper fine particles under nitrogen gas flow with Cu<sup>2+</sup>-alkanolamine metallacycle compounds for electrically conductive layer formationHigh temperature oxidation event of gelatin nanoskin-coated copper fine particles observed by <i>in situ</i> TEMHigh-Concentration Synthesis of Sub-10-nm Copper Nanoparticles for Application to Conductive NanoinksCopper film prepared from copper fine particle paste by laser sintering at room temperature: Influences of sintering atmosphere on the morphology and resistivityNanoparticulate copper – routes towards oxidative stabilitySize-Controlled Oxidation-Resistant Copper Fine Particles Covered by Biopolymer NanoskinComparison of reductive nanoparticle preparation using plasma and ultrasound irradiation in aqueous solutionFormate-Free Metal-Organic Decomposition Inks of Copper Particles and Self-Reductive Copper Complex for the Fabrication of Conductive Copper FilmsGraphene-stabilized copper nanoparticles as an air-stable substitute for silver and gold in low-cost ink-jet printable electronicsMorphology, large scale synthesis and building applications of copper nanomaterialsCopper pastes using bimodal particles for flexible printed electronicsProgress of alternative sintering approaches of inkjet-printed metal inks and their application for manufacturing of flexible electronic devicesNanomaterial Synthesis Using Plasma Generation in LiquidLarge-Scale and Galvanic Replacement Free Synthesis of Cu@Ag Core–Shell Nanowires for Flexible ElectronicsMicrowave-Assisted Preparation of Inorganic Nanostructures in Liquid PhaseThermolysis of gold(i) thiolate complexes producing novel gold nanoparticles passivated by alkyl groupsThe polyol process: a unique method for easy access to metal nanoparticles with tailored sizes, shapes and compositionsMicrowave-Assisted Green Synthesis of Silver NanostructuresA Highly Reliable Copper Nanowire/Nanoparticle Ink Pattern with High Conductivity on Flexible Substrate Prepared via a Flash Light-Sintering TechniqueSonochemical Synthesis of Well-Dispersed Gold Nanoparticles at the Ice TemperatureCu and Cu-Based Nanoparticles: Synthesis and Applications in Catalysis<i>In-Situ</i> Heating TEM Observation of Microscopic Structural Changes of Size-Controlled Metallic Copper/Gelatin CompositeFabrication of Elemental Copper by Intense Pulsed Light Processing of a Copper Nitrate Hydroxide InkCopper Nanoparticles for Printed Electronics: Routes Towards Achieving Oxidation StabilitySintering Copper Nanoparticles with Photonic Additive for Printed Conductive Patterns by Intense Pulsed LightIntense pulsed light sintering of copper nanoink for printed electronicsOne-Step Fabrication of Copper Electrode by Laser-Induced Direct Local Reduction and Agglomeration of Copper Oxide NanoparticleSize-dependent melting of spherical copper nanoparticles embedded in a silica matrixA novel method to prepare Cu@Ag core–shell nanoparticles for printed flexible electronicsSilica-coating of metallic copper nanoparticles in aqueous solutionMechanisms of Nucleation and Growth of Nanoparticles in SolutionUse of decomposable polymer-coated submicron Cu particles with effective additive for production of highly conductive Cu films at low sintering temperatureMicrowave-Assisted Chemistry: Synthetic Applications for Rapid Assembly of Nanomaterials and OrganicsThe mechanism of alkylamine-stabilized copper fine particles towards improving the electrical conductivity of copper films at low sintering temperatureA Self-Reducible and Alcohol-Soluble Copper-Based Metal–Organic Decomposition Ink for Printed ElectronicsMatrix Sputtering Method: A Novel Physical Approach for Photoluminescent Noble Metal NanoclustersReview of recent advances in inorganic photoresistsToward Greener NanosynthesisSynthesis, Characterization, and Applications of Copper NanoparticlesCopper conductive inks: synthesis and utilization in flexible electronicsReactive Sintering of Cu Nanoparticles at Ambient Conditions for Printed ElectronicsLarge-scale synthesis of copper nanoparticles by chemically controlled reduction for applications of inkjet-printed electronicsLaser Synthesis and Processing of Colloids: Fundamentals and ApplicationsGreen laser sintering of copper oxide (CuO) nano particle (NP) film to form Cu conductive linesStabilization of the thermal decomposition process of self-reducible copper ion ink for direct printed conductive patternsPursuing the Crystallization of Mono- and Polymetallic Nanosized Crystalline Inorganic Compounds by Low-Temperature Wet-Chemistry and Colloidal RoutesRoom Temperature Synthesis of a Copper Ink for the Intense Pulsed Light Sintering of Conductive Copper FilmsPoly(ethylene imine) and Tetraethylenepentamine as Protecting Agents for Metallic Copper NanoparticlesInorganic nanomaterials for printed electronics: a reviewCu-Ag core–shell nanoparticles with enhanced oxidation stability for printed electronicsマイクロ波液中プラズマ法による銅微粒子の合成電気伝導率と熱伝導率のデータ群とボルツマン定数Effect of Glass Transition Temperature of Stabilizing Polymer of Air-Stable Gelatin-Stabilized Copper Fine Particles during Redox Two-Step Low-Temperature Sintering Process
- 連携機関・データベース
- 国立情報学研究所 : CiNii Research
- 提供元機関・データベース
- Japan Link Center雑誌記事索引データベースCrossrefCrossrefCrossrefCrossrefCrossrefCrossrefCrossref
- 書誌ID（NDLBibID）
- 032129409