Adhesive joining and coating technology in electronics manufacturing : 3rd International conference : Sep 1998, Binghamton, NY.

著者: Institute of Electrical and Electronics Engineers. Components, Packaging and Manufacturing Technology Society (CPMT)ほか

資料に関する注記

一般注記：: Papers and abstracts.Held at Adhesives '98. IEEE cat no 98EX180.Index term: adhesive joining ; electronics manufacturing ; coating technology ; IEEE....

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資料種別: 図書
ISBN: 0780343942 (pbk)
0780343950 (microfiche)
タイトル: Adhesive joining and coating technology in electronics manufacturing : 3rd International conference : Sep 1998, Binghamton, NY.
著者標目: Institute of Electrical and Electronics Engineers. Components, Packaging and Manufacturing Technology Society (CPMT)
State University of New York at Binghamton. Integrated Electronics Engineering Center (IEEC)
出版事項: IEEE
出版年月日等: 1998.
出版年（W3CDTF）: 1998
数量: v.
並列タイトル等: Held at Adhesives '98. IEEE cat no 98EX180
adhesive joining ; electronics manufacturing ; coating technology ; IEEE
NDLC: M17
ND
一般注記: Papers and abstracts.
Held at Adhesives '98. IEEE cat no 98EX180.
Index term: adhesive joining ; electronics manufacturing ; coating technology ; IEEE.
BL shelfmark: 6844.5178 3rd 1998.
所蔵機関: 国立国会図書館
請求記号: M17-99-1671
連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書
https://ndlsearch.ndl.go.jp
書誌ID（NDLBibID）: 000003509223
http://id.ndl.go.jp/bib/000003509223
UKMARC番号: G05772407
整理区分コード: 215