数量viii, 224 p. : ill. ; 24 cm.
一般注記Papers.
"... the papers presented at the symposium on Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Interlevel Dielectrics ... was held as part of the 198th meeting of the Electrochemical Society, Inc. in Phoenix, AZ, October 22-27, 2000" -- pref.
"Dielectric Science & Technology, Electronics, and Electrodeposition Divisions" -- t. p.
書誌注記Includes bibliographical references and indexes.