Evaluation of the transient liquid phase (TLP) bonding process for Ti₃-Based honeycomb core sandwich structure [microform] / R. Keith Bird and Eric K. Hoffman ([NASA technical paper] ; NASA/TP-1998-208421)
Evaluation of the transient liquid phase (TLP) bonding process for Ti₃-Based honeycomb core sandwich structure [microform] / R. Keith Bird and Eric K. Hoffman
原資料の出版事項: Hampton, Va. ; Springfield, VA : National Aeronautics and Space Administration, Langley Research Center : National Technical Information Service, distributor, [1998]