Guidelines for preparing applications [microform] / TIIAP, Telecommunications and Information Infrastructure Assistance Program

• 資料種別: 図書
• タイトル: Guidelines for preparing applications [microform] / TIIAP, Telecommunications and Information Infrastructure Assistance Program
• 著者標目: Telecommunications and Information Infrastructure Assistance Program (U.S.); Technology Opportunities Program (U.S.)
• 数量: microfiche
• 大きさ: 11 × 15 cm
• 並列タイトル等: TIIAP; Telecommunications and information infrastructure assistance program; Notice of availability of grant funds
• 出版地（国名コード）: US
• 本文の言語コード: eng
• 資料種別（注記）: [microform]
• 件名標目: Telecommunication -- United States -- Finance -- Periodicals; Grants-in-aid -- United States -- Periodicals
• 一般注記: Annual; Dates of publication and/or sequential designation: Began in 1994?; Issue for 1997 includes publication: Notice of availability of grant funds; Description based on: Fiscal Year 1997; title from cover; Physical description for original version: v. : 28 cm
• 原資料等に関する注記: 原資料の出版事項: Washington, D.C. : U.S. Dept. of Commerce, National Telecommunications and Information Administration; SUPTDOC番号: C 60.8: T 23/2; GPO管理番号: 0126-E-02 (MF); GPO管理番号: 0126-E-02 (online)
• 所蔵機関: 国立国会図書館
• 請求記号: YCA-C 60.8: T 23/2
• 連携機関・データベース: 国立国会図書館 : 国立国会図書館蔵書; https://ndlsearch.ndl.go.jp
• 書誌ID（NDLBibID）: 000006635410; http://id.ndl.go.jp/bib/000006635410
• OCLC番号: 43437941; https://www.worldcat.org/oclc/43437941
• 整理区分コード: 281