Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 15-18, 1998 :softbound

• 資料種別: 図書
• ISBN: 0780347951
• タイトル: Proceedings : 4th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, Chateau Elan, Braselton, Georgia, March 15-18, 1998
• 巻次・部編番号: :softbound
• 著者・編者: co-sponsored by International Microelectronics and Packaging Society (IMAPS), IEEE Components, Packaging, and Manufacturing Technology (CPMT) ; participating societies: American Society of Metals ...[et al.] ; general chair, C.P. Wong ; technical chairs, George White, Rao Tummala
• 著者標目: International Symposium on Advanced Packaging Materials; International Microelectronics and Packaging Society; Components, Packaging & Manufacturing Technology Society; https://ci.nii.ac.jp/author/DA08354018; American Society of Metals; Wong, C. P.; https://ci.nii.ac.jp/author/DA07161777; White, George; Tummala, Rao R.; https://ci.nii.ac.jp/author/DA03687931
• 出版事項: IMAPS; IEEE
• 出版年月日等: [1998]
• 出版年（W3CDTF）: 1998
• 大きさ: 28 cm
• 並列タイトル等: 4th International Symposium on Advanced Packaging Materials; 4th International Symposium and Exhibition on Advanced Packaging Materials; 1998 proceedings, International Symposium and Exhibition on Advanced Packaging Materials; 98EX153
• 出版地（国名コード）: us
• 本文の言語コード: en
• 件名標目: Electronic packaging -- Materials -- Congresses
• LCC: TK7870.15
• 対象利用者: 一般
• 一般注記: "IEEE catalog number 98EX153"--verso of T.p; Includes bibliographical references and author index
• 関連情報（URI）: https://ci.nii.ac.jp/ncid/BA48882591#entity; https://lccn.loc.gov/98149250
• 連携機関・データベース: 国立情報学研究所 : CiNii Research
• 提供元機関・データベース: CiNii Books; https://ci.nii.ac.jp/books
• NACSIS書誌ID（NCID）: https://ci.nii.ac.jp/ncid/BA48882591 : BA48882591
• LC control number: 98149250; https://lccn.loc.gov/98149250