Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium

• 資料種別: 図書
• ISBN: 1566773938
• タイトル: Thin film materials, processes, and reliability, plasma processing for the 100 nm node and copper interconnects with low-k inter-level dielectric films : proceedings of the international symposium
• 著者・編者: editor, G.S. Mathad ; assistant editors, T. S. Cale ...[et al.] ; sponsoring divisions, Dielectric Science and Technology, Electronics
• 著者標目: Mathad, G. S.; https://ci.nii.ac.jp/author/DA03249537; Cale, T. S.; Electrochemical Society. Dielectric Science and Technology Division; https://ci.nii.ac.jp/author/DA06421624; Electrochemical Society. Electronics Division; https://ci.nii.ac.jp/author/DA0357072X
• 出版事項: Electrochemical Society
• 出版年月日等: c2003
• 出版年（W3CDTF）: 2003
• 大きさ: 24 cm
• 出版地（国名コード）: us
• 本文の言語コード: en
• 件名標目: Thin film devices -- Design and construction -- Congresses; Thin films -- Congresses
• LCC: TK7872.T55
• 対象利用者: 一般
• 一般注記: Includes bibliographical references and indexes
• 関連情報: Proceedings; https://cir.nii.ac.jp/crid/1130282269273401728
• 関連情報（URI）: https://ci.nii.ac.jp/ncid/BA6623218X#entity; https://lccn.loc.gov/2003109518
• 掲載誌: Proceedings; https://cir.nii.ac.jp/crid/1130282269273401728
• 連携機関・データベース: 国立情報学研究所 : CiNii Research
• 提供元機関・データベース: CiNii Books; https://ci.nii.ac.jp/books
• NACSIS書誌ID（NCID）: https://ci.nii.ac.jp/ncid/BA6623218X : BA6623218X
• LC control number: 2003109518; https://lccn.loc.gov/2003109518