2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA

• 資料種別: 図書
• ISBN: 0780384369
• タイトル: 2004 proceedings, 9th International Symposium on Advanced Packaging Materials : processes, properties and interfaces, March 24-26, 2004, Atlanta, Georgia, USA
• 著者・編者: sponsors, IEEE Components, Packaging and Manufacturing Technology(CPMT) Society, Packaging Research Center at Georgia Tech(GT-PRC) ; technical sponsor, Fraunhofer IZM ; general chair, Petri Savolainen ; general chair elect, Jianmin Qu ; technical chair, Petri Savolainen ; technical chair elect, Suresh Sitaraman
• 著者標目: International Symposium on Advanced Packaging Materials; https://ci.nii.ac.jp/author/DA13111616; Components, Packaging & Manufacturing Technology Society; https://ci.nii.ac.jp/author/DA08354018; Georgia Insitute of Technology, Packaging Research Center; Fraunhofer Institut Zuverlässigkeit Microintegration; Qu, Jianmin; Savolainen, Petri; Sitaraman, Suresh
• 出版事項: IEEE Service Center
• 出版年月日等: c2004
• 出版年（W3CDTF）: 2004
• 大きさ: 28 cm
• 並列タイトル等: 2004 9th International Symposium Advanced Packaging Materials : processes, properties, interfaces, March 24-26, 2004, Grand Hyatt, Atlanta, Georgia, USA; 04TH8742
• 出版地（国名コード）: us
• 本文の言語コード: en
• 件名標目: Electronic packaging -- Materials Congresses
• 対象利用者: 一般
• 一般注記: "IEEE Catalog Number: 04TH8742" -- T. p. verso; Includes bibliographic references
• 関連情報（URI）: https://ci.nii.ac.jp/ncid/BA67149194#entity
• 連携機関・データベース: 国立情報学研究所 : CiNii Research
• 提供元機関・データベース: CiNii Books; https://ci.nii.ac.jp/books
• NACSIS書誌ID（NCID）: https://ci.nii.ac.jp/ncid/BA67149194 : BA67149194