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- Uhlig's corrosion handbookVapor depositionFundamentals of electrochemistryArcs in inert atmospheres and vacuumAtmospheric corrosionHigh-temperature technologyThe Primary batterySynthetic diamond : emerging CVD science and technologyElectrochemical oxygen technologyModern electroplatingLithium battery technologyTechnology of columbium (niobium) : papers presented at the Symposium on Columbium (niobium) of the Electrothermics and Metallurgy division of the Electrochemical Society, May 15 and 16, 1958, Washington, D. CThe structure of electrolytic solutionsStress corrosion cracking and embrittlementModern electroplatingQuality and reliability methods for primary batteriesVapor-plating : the formation of coatings by vapor-deposition techniquesModern electroplatingAlkaline storage batteriesThe corrosion handbookTransactions of the symposium on electrode processesThe corrosion handbookElectrochemical power sources : batteries, fuel cells, and supercapacitorsFundamentals of electrochemical depositionChemical physics of ionic solutions : a selection of invited papers and discussions presented at an International Symposium of the Electrochemical Society in Toronto, Canada, May 4-6, 1964Thin films : interdiffusion and reactionsFirst international conference on electron and ion beam science and technologyHigh-temperature materials and technologyHigh-temperature technologyFuel cells : problems and solutionsElectrochemistry in biology and medicineVapor-plating : the formation of coatings by vapor-deposition techniquesElectrochemical impedance spectroscopyUltrafine particlesUhlig's corrosion handbookZinc-silver oxide batteriesTechniques for characterization of electrodes and electrochemical processesIodide metals and metal iodidesVapor depositionLead-acid batteriesElectrochemical impedance spectroscopyModern electroplatingHigh-temperature technologyLithium batteries : advanced technologies and applicationsFundamentals of electrochemical depositionThe electron microprobe : proceedings of the symposium sponsored by the Electrothermics and Metallurgy Division, the Electrochemical Society, Washington, D.C., October, 1964Modern electroplatingSemiconductor wafer bonding : science and technologyElectrochemical systems
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- https://ci.nii.ac.jp/ncid/BA04442376 : BA04442376