微小流路型反応器を利用した銅めっき液中添加剤作用の解析 (シリコン材料・デバイス)

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微小流路型反応器を利用した銅めっき液中添加剤作用の解析

(シリコン材料・デバイス)

Call No. (NDL)
Z16-940
Bibliographic ID of National Diet Library
023573925
Material type
記事
Author
齊藤 丈靖ほか
Publisher
東京 : 電子情報通信学会
Publication date
2012-03-05
Material Format
Paper
Journal name
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報 111(463):2012.3.5
Publication Page
p.31-35
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Paper

Material Type
記事
Author/Editor
齊藤 丈靖
宮本 豊
服部 直 他
Alternative Title
Evaluation of additives effects in copper electroplating solution by rapid exchange using microfluidic reactor
Periodical title
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報
No. or year of volume/issue
111(463):2012.3.5
Volume
111
Issue
463