グラウンドスルーホールランド共通化NSMDパッド構造を用いた異種基板間BGA接続構造の不要漏洩抑圧に関する検討 (マイクロ波)

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グラウンドスルーホールランド共通化NSMDパッド構造を用いた異種基板間BGA接続構造の不要漏洩抑圧に関する検討

(マイクロ波)

Call No. (NDL)
Z16-940
Bibliographic ID of National Diet Library
023574924
Material type
記事
Author
湯浅 健ほか
Publisher
東京 : 電子情報通信学会
Publication date
2012-03
Material Format
Paper
Journal name
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報 111(458):2012.3.1・2
Publication Page
p.109-113
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Paper

Material Type
記事
Author/Editor
湯浅 健
都築 秀樹
森本 卓男 他
Series Title
Alternative Title
A study on suppression of undesired leakage from the BGA interconnects using unified ground through-hole lands of the NSMD pads
Periodical title
電子情報通信学会技術研究報告 = IEICE technical report : 信学技報
No. or year of volume/issue
111(458):2012.3.1・2
Volume
111
Issue
458