直流電位差法を用いた一定および変動温度繰返し負荷下における鉛フリーはんだボール/銅接合界面割れのモニタリング
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- Material Type
- 記事
- Author/Editor
- 竹原 隆司多田 直哉
- Alternative Title
- Monitoring of Crack on Lead-free Solder Ball/Copper Joint Interface under Cyclic Loading at Constant and Varied Temperature by DC-PDM
- Periodical title
- 銅と銅合金 : 銅及び銅合金技術研究会誌 = Copper and copper alloy : journal of Japan Research Institute for Advanced Copper-Base Materials and Technologies / 銅及び銅合金技術研究会 [編]
- No. or year of volume/issue
- 51(1):2012
- Volume
- 51
- Issue
- 1
- Pages
- 284-289