電気銅めっき制御槽に...

電気銅めっき制御槽における電流密度分布推定法 (小特集 めっきにおける分析技術(1))

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電気銅めっき制御槽における電流密度分布推定法(小特集 めっきにおける分析技術(1))

Call No. (NDL)
Z17-291
Bibliographic ID of National Diet Library
023926136
Material type
記事
Author
岸本 喜直ほか
Publisher
東京 : 表面技術協会
Publication date
2012-08
Material Format
Paper
Journal name
表面技術 = Journal of the Surface Finishing Society of Japan 63(8):2012.8
Publication Page
p.503-506
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Paper Digital

Material Type
記事
Author/Editor
岸本 喜直
大塚 年久
小林 志好 他
Alternative Title
An Estimation Method of Current Density Distribution for Copper Electroplating Control Cell
Periodical title
表面技術 = Journal of the Surface Finishing Society of Japan
No. or year of volume/issue
63(8):2012.8
Volume
63
Issue
8