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教育現場から見たボード検査への期待 (特集 エレクトロニクス実装技術の現状と展望)

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教育現場から見たボード検査への期待(特集 エレクトロニクス実装技術の現状と展望)

Call No. (NDL)
Z74-B258
Bibliographic ID of National Diet Library
024217188
Material type
記事
Author
検査技術委員会
Publisher
東京 : エレクトロニクス実装学会
Publication date
2013-01
Material Format
Paper
Journal name
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging 16(1)=105:2013.1
Publication Page
p.25-28
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Paper Digital

Material Type
記事
Author/Editor
検査技術委員会
Author Heading
Alternative Title
Expectation for Board Testing from the Point of View in Engineering Education
Periodical title
エレクトロニクス実装学会誌 = Journal of the Japan Institute of Electronics Packaging
No. or year of volume/issue
16(1)=105:2013.1
Volume
16
Issue
1