実装残留応力に起因す...

実装残留応力に起因する半導体デバイスの電気特性変動シミュレーション

Icons representing 記事

実装残留応力に起因する半導体デバイスの電気特性変動シミュレーション

Call No. (NDL)
Z14-B378
Bibliographic ID of National Diet Library
024243659
Material type
記事
Author
小金丸 正明ほか
Publisher
東京 : 日本計算工学会
Publication date
2010-05
Material Format
Paper
Journal name
計算工学講演会論文集 = Proceedings of the Conference on Computational Engineering and Science / 日本計算工学会 編 15(1):2010.5
Publication Page
p.63-66
View All

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

  • CiNii Research

    Search Service
    You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.

Bibliographic Record

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Paper

Material Type
記事
Author/Editor
小金丸 正明
吉田 圭佑
池田 徹 他
Alternative Title
DEVICE SIMULATION FOR PACKAGING-STRESS-INDUCED VARIATIONS ON ELECTRICAL CHARACTERISTICS OF SEMICONDUCTOR DEVICES
Periodical title
計算工学講演会論文集 = Proceedings of the Conference on Computational Engineering and Science / 日本計算工学会 編
No. or year of volume/issue
15(1):2010.5
Volume
15
Issue
1
Pages
63-66