E-band帯送信用MMICチップセットの開発

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Material Type: 記事
Title: E-band帯送信用MMICチップセットの開発
Author/Editor: 與那嶺淳
久保田幹
馬場修他
Author Heading: 與那嶺淳
久保田幹
馬場修
Alternative Title: Development of E-band Transmitter Chipset Using Wafer Level Chip Size Package Technology
Periodical title: 住友電工テクニカルレビュー = Technical review : 住友電工グループ技術論文誌
No. or year of volume/issue: (182):2013.1
Issue: 182
Pages: 85-89
Publication date of volume/issue (W3CDTF): 2013-01
ISSN (Periodical Title): 1343-4330
ISSN-L (Periodical Title): 1343-4330
Publication (Periodical Title): 大阪 : 住友電気工業
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: 3D-MMIC
WLCSP
E-band
transmitter
NDLC: ZN31
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-298
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024251442
http://id.ndl.go.jp/bib/024251442
Bibliographic Record Category (NDL): 632