半導体センサ素子向け低応力パッケージング(豊かな未来社会を拓くエレクトロニクス製品の「もの創り」に向けてエレクトロニクス生産科学部会の設立)

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Material Type: 記事
Title: 半導体センサ素子向け低応力パッケージング
Author/Editor: 佐名川佳治
Series Title: 豊かな未来社会を拓くエレクトロニクス製品の「もの創り」に向けてエレクトロニクス生産科学部会の設立
Author Heading: 佐名川佳治
Alternative Title: Low Stress Packaging for Semiconductor Sensor
Periodical title: スマートプロセス学会誌 = Journal of smart processing
No. or year of volume/issue: 2(1):2013.1
Volume: 2
Issue: 1
Pages: 12-16
Publication date of volume/issue (W3CDTF): 2013-01
ISSN (Periodical Title): 2186-702X
ISSN-L (Periodical Title): 2186-702X
Publication (Periodical Title): 大阪 : 高温学会
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: Water Level Package
Room Temperature Bonding
Surface Activation
Stress Relaxation
MEMS
NDLC: ZM35
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-H317
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024253011
http://id.ndl.go.jp/bib/024253011
Bibliographic Record Category (NDL): 632