Sn/Sn固相接合強...

Sn/Sn固相接合強度に対する金属塩生成接合法の適用効果 (豊かな未来社会を拓くエレクトロニクス製品の「もの創り」に向けて エレクトロニクス生産科学部会の設立)

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Sn/Sn固相接合強度に対する金属塩生成接合法の適用効果(豊かな未来社会を拓くエレクトロニクス製品の「もの創り」に向けて エレクトロニクス生産科学部会の設立)

Call No. (NDL)
Z74-H317
Bibliographic ID of National Diet Library
024253191
Material type
記事
Author
小山 真司
Publisher
大阪 : 高温学会
Publication date
2013-01
Material Format
Paper
Journal name
スマートプロセス学会誌 = Journal of smart processing 2(1):2013.1
Publication Page
p.47-51
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Paper Digital

Material Type
記事
Author/Editor
小山 真司
Author Heading
Alternative Title
Application Effect of Metal Salt Generation Bonding Method on Solid State Bonding Strength of Sn/Sn
Periodical title
スマートプロセス学会誌 = Journal of smart processing
No. or year of volume/issue
2(1):2013.1
Volume
2
Issue
1