低融点はんだを用いたフリップチップ接合技術(エレクトロニクス分野における低温接合・実装プロセス技術の最前線)

Holdings of Libraries in Japan

This page shows libraries in Japan other than the National Diet Library that hold the material.

Please contact your local library for information on how to use materials or whether it is possible to request materials from the holding libraries.

other

CiNii Research
Search Service
Digital
You can check the holdings of institutions and databases with which CiNii Research is linked at the site of CiNii Research.
Check the holdings of this book

You can check the details of this material, its authority (keywords that refer to materials on the same subject, author's name, etc.), etc.

Material Type: 記事
Title: 低融点はんだを用いたフリップチップ接合技術
Author/Editor: 山中公博
Series Title: エレクトロニクス分野における低温接合・実装プロセス技術の最前線
Author Heading: 山中公博
Alternative Title: Flip-Chip Bonding Technologies with Low Melting Point Solders
Periodical title: スマートプロセス学会誌 = Journal of smart processing
No. or year of volume/issue: 1(3):2012.5
Volume: 1
Issue: 3
Pages: 114-119
Publication date of volume/issue (W3CDTF): 2012-05
ISSN (Periodical Title): 2186-702X
ISSN-L (Periodical Title): 2186-702X
Publication (Periodical Title): 大阪 : 高温学会
Place of Publication (Country Code): JP
Text Language Code: jpn
Subject Heading: Flip-Chip
Solder
Low Melting Point
Indium
Pb Free
NDLC: ZM35
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z74-H317
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024272645
http://id.ndl.go.jp/bib/024272645
Bibliographic Record Category (NDL): 632