シリコンチップの新接合技術 (エレクトロニクス分野における低温接合・実装プロセス技術の最前線)
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CiNii Research
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- Material Type
- 記事
- Title
- Author/Editor
- 水野 潤佐久間 克幸宇波 奈保子 他
- Series Title
- Alternative Title
- New Chip Joint Method for Silicon Die Bonding
- Periodical title
- スマートプロセス学会誌 = Journal of smart processing
- No. or year of volume/issue
- 1(3):2012.5
- Volume
- 1
- Issue
- 3