Sn-Ag-Cuはんだバンプ継手の破壊形態と耐衝撃性に及ぼす界面反応層厚さの影響
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- Material Type
- 記事
- Author/Editor
- 大藤 友也西川 宏竹本 正
- Alternative Title
- Effect of Interfacial Reaction Layer Thickness on Fracture Morphology and Impact Resistance of Sn-Ag-Cu Solder Bump Joint
- Periodical title
- スマートプロセス学会誌 = Journal of smart processing
- No. or year of volume/issue
- 1(3):2012.5
- Volume
- 1
- Issue
- 3
- Pages
- 143-148