三次元集積化に向けた微小Auバンプ電極と接着剤のハイブリッド接合技術 (特集接合・接着技術と部材)

三次元集積化に向けた微小Auバンプ電極と接着剤のハイブリッド接合技術

(特集接合・接着技術と部材)

Journal name: ディスプレイ = Monthly display : FPD・照明・太陽電池の総合技術情報誌 / 月刊ディスプレイ編集委員会編 19(3)=214:2013.3

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Material Type: 記事
Title: 三次元集積化に向けた微小Auバンプ電極と接着剤のハイブリッド接合技術
Author/Editor: 仁村将次
庄子習一
水野潤他
Series Title: 特集接合・接着技術と部材
Author Heading: 仁村将次
庄子習一
水野潤
Alternative Title: Hybrid Bonding Technology of Au Microbump and Adhesive for 3D Integration
Periodical title: ディスプレイ = Monthly display : FPD・照明・太陽電池の総合技術情報誌 / 月刊ディスプレイ編集委員会編
No. or year of volume/issue: 19(3)=214:2013.3
Volume: 19
Issue: 3
Sequential issue number: 214
Pages: 23-29
Publication date of volume/issue (W3CDTF): 2013-03
ISSN (Periodical Title): 1341-3961
ISSN-L (Periodical Title): 1341-3961
Publication (Periodical Title): 東京 : テクノタイムズ社
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN33
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-B314
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024350756
http://id.ndl.go.jp/bib/024350756
Bibliographic Record Category (NDL): 632