熱シミュレーションと設計法(14)熱流体シミュレーションを用いた電子機器の熱解析のための電子部品のモデル化(その4)多孔板のモデル化

Journal name: EMC : electro magnetic compatibility : solution technology : 電磁環境工学情報 25(12)=300:2013.4

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Material Type: 記事
Title: 熱シミュレーションと設計法(14)熱流体シミュレーションを用いた電子機器の熱解析のための電子部品のモデル化(その4)多孔板のモデル化
Author/Editor: 小泉雄大
Author Heading: 小泉雄大
Periodical title: EMC : electro magnetic compatibility : solution technology : 電磁環境工学情報
No. or year of volume/issue: 25(12)=300:2013.4
Volume: 25
Issue: 12
Sequential issue number: 300
Pages: 124-128
Publication date of volume/issue (W3CDTF): 2013-04
ISSN (Periodical Title): 0916-2275
ISSN-L (Periodical Title): 0916-2275
Publication (Periodical Title): つくば : [科学情報出版]
Place of Publication (Country Code): JP
Text Language Code: jpn
NDLC: ZN31
Target Audience: 一般
Holding library: 国立国会図書館
Call No.: Z16-1910
Data Provider (Database): 国立国会図書館 : 国立国会図書館雑誌記事索引
https://ndlsearch.ndl.go.jp
Bibliographic ID (NDL): 024648420
http://id.ndl.go.jp/bib/024648420
Bibliographic Record Category (NDL): 632